Shock-resistive printed circuit board and electronic device including the same
First Claim
1. A printed circuit board comprising a layer including a resin material, a tensile breaking strain of which is approximately 1% or more at a tensile strain rate of 40%/sec at 25°
- C.
1 Assignment
0 Petitions
Accused Products
Abstract
A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by β relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by β′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.
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Citations
29 Claims
- 1. A printed circuit board comprising a layer including a resin material, a tensile breaking strain of which is approximately 1% or more at a tensile strain rate of 40%/sec at 25°
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7. A printed circuit board comprising a layer including a resin material at a percentage content of approximately 80 wt % or more, the resin material having a peak value of dynamic loss tangent of 0.05 or more in a range of −
- 100°
C. to −
50°
C. by β
relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0°
C. to 100°
C. by β
′
relaxation in a dynamic viscoelasticity spectral measurement. - View Dependent Claims (8, 9, 10, 11)
- 100°
- 12. A printed circuit board comprising a layer formed from a resin main component, a molecule of which has a side chain including a functional group and branching from a main chain.
- 22. A printed circuit board comprising a layer formed from a setting agent, a molecule of which has a side chain branching from a main chain and including a functional group, the layer being exposed on a surface of the printed circuit board.
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25. An electronic device comprising:
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a printed circuit board including;
a plurality of insulation layers laminated with each other;
a wiring pattern arranged in the plurality of insulation layers; and
a layer disposed on the plurality of insulation layers to be exposed on a surface of the printed circuit board and including a resin material, the resin material having one of first and second features, the first feature being that a tensile strain of the resin material is approximately 1% or more at a tensile strain rate of 40%/sec at 25°
C., the second feature being that the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −
100°
C. to −
50°
C. by β
relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0°
C. to 100°
C. by β
′
relaxation in a dynamic viscoelasticity spectral measurement; and
an electronic part disposed on the printed circuit board to be electrically connected to the wiring pattern. - View Dependent Claims (26, 27, 28)
the printed circuit board has a bump disposed on the plurality of insulation layers for electrically connecting the electronic part and the wiring pattern; and
the layer exposed on the surface of the printed circuit board is a soldering resist layer.
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27. The electronic device of claim 25, wherein the layer exposed on the surface of the printed circuit board is an insulation layer laminated with the plurality of insulation layers.
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28. The electronic device of claim 25, wherein the resin material of the layer has a network structure including a plurality of side chains branching from a plurality of main chains.
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29. An electronic device comprising:
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a printed circuit board including;
a plurality of insulation layers laminated with each other;
a wiring pattern arranged in the plurality of insulation layers; and
a layer disposed on the plurality of insulation layers to be exposed on a surface of the printed circuit board and including a resin material, the resin material having a network structure having a plurality of bridging points of main chains, the plurality of bridging points each having at least two side chains branching therefrom; and
an electronic part disposed on the printed circuit board to be electrically connected to the wiring pattern.
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Specification