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Semiconductor light emitting device and its manufacturing method

  • US 6,274,890 B1
  • Filed: 01/13/1998
  • Issued: 08/14/2001
  • Est. Priority Date: 01/15/1997
  • Status: Expired due to Term
First Claim
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1. A semiconductor light emitting device comprising:

  • a semiconductor light emitting element;

    a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;

    a light-transmissive resin filling said recess of said resin stem; and

    a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around, said projection not in contact with said first and second leads extending from said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.

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