Semiconductor light emitting device and its manufacturing method
First Claim
1. A semiconductor light emitting device comprising:
- a semiconductor light emitting element;
a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin filling said recess of said resin stem; and
a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around, said projection not in contact with said first and second leads extending from said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
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Accused Products
Abstract
A semiconductor light emitting device includes a semiconductor light emitting element (1), a resin stem (10) having a recess (7), and a projection (9) made of a light-transmissive thermosetting resin on the resin stem so as to cover the entire upper surface and continuous upper part of side surfaces of the resin stem to a predetermined depth. The recess is filled with a light-transmissive resin encapsulating element (5) to embed the semiconductor light emitting element, one end of an externally extended first lead (21) and one end of an externally extended second lead (22) electrically connected to first and second electrodes of the semiconductor light emitting element, and a bonding wires (4) connecting the second lead to the second electrode. The projection functions as a lens and is made by hardening a fluid-state resin in an encapsulating case mold. Since the projection extends over the upper surface and upper part of side surfaces continuous from the upper surface, it is firmly bonded to the resin stem with a high adherability.
288 Citations
25 Claims
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1. A semiconductor light emitting device comprising:
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a semiconductor light emitting element;
a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin filling said recess of said resin stem; and
a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around, said projection not in contact with said first and second leads extending from said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 23)
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11. A semiconductor light emitting device comprising:
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a semiconductor light emitting element;
a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin filling said recess of said resin stem; and
a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
wherein said recess of said resin stem is longer in a first horizontal direction in which said first and second leads extend than in a second horizontal direction normal to said first horizontal direction, and said projection is not in contact with said first and second leads at said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 24)
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19. A semiconductor light emitting device comprising:
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a semiconductor light emitting element;
a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead extending externally from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin filling said recess of said resin stem; and
a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
wherein inner side surfaces of said recess serve as reflective surfaces, and said projection is not in contact with said first and second leads on said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion. - View Dependent Claims (20, 21, 22, 25)
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Specification