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Segmented architecture for wafer test and burn-in

  • US 6,275,051 B1
  • Filed: 01/29/1999
  • Issued: 08/14/2001
  • Est. Priority Date: 12/29/1997
  • Status: Expired due to Term
First Claim
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1. A test head, comprising:

  • a first board and a second board;

    said first board having a probe side and a connection side, said probe side having probes for contacting at least one die on a product wafer, said connection side being adapted for electrical connections to said second board; and

    said second board having a contact side and a tester chip side, said contact side having contacts for electrical connection to said connection side of said first board, said tester chip side having a tester chip for distributing power to said die or for testing said die.

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