Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component

• US 6,275,158 B1
• Filed: 12/20/1999
• Issued: 08/14/2001
• Est. Priority Date: 12/22/1998
• Status: Expired due to Term

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Scheucher, Wolfgang, Kwas, Heinz, Schaffler, Gerald, Toth, Marcus
• Primary Examiner(s): Lee, Benjamin C.
• Application Number:
  US09/467,594
• Time in Patent Office: 603 Days
• Field of Search: 340/572.1, 340/572.8, 340/5.8, 340/10.2, 340/10.1, 340/5.31, 340/5.61, 361/737, 361/748, 361/760, 361/772, 361/774, 361/777, 361/779, 342/51, 307/10.5, 298/55, 298/25, 298/29, 298/46, 343/895, 343/872, 343/795, 343/822
• US Class Current: 340/572.8
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G07C 2009/00769 with data transmission performed by wireless means
• CPC Class Codes: G07C 9/00944 Details of construction or manufacture
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means (6) include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) of the conductor frame (18) and are completely enclosed by the casing (5), at least parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) being connected to the holding foil (17) in order to hold said conductor segments.

Claims

1. A device (1) which is provided with a data carrier (4) which is arranged for contactless communication with a communication station,

includes a casing (5) which consists of an electrically insulating material and is formed by injection molding,

includes holding means (6) which are surrounded by the casing (5) and are arranged to hold a chip (7) and at least one passive component (8, 13;

44) which is suitable for contactless communication, and

is also provided with electrically conductive connection means (16) which are surrounded by the casing (5), thus being fully enclosed by the casing (5), are connected to the holding means (6) and by means of which a respective chip terminal (9, 10) of the chip (7) is electrically conductively connected to a respective component terminal (11, 12, 14, 15) of the at least one component (8, 13;

44),

characterized in that

the holding means (6) include a holding foil (17) of an electrically non-conductive synthetic material,

that the connection means (16) are realized while utilizing a conductor frame (18) consisting of metal,

that the connection means (16) are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) which are completely enclosed by the casing (5), and

that at least parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) are connected to the holding foil (17) in order to hold said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46).

2. A device (1) as claimed in claim 1, characterized in that

in addition to the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) in said conductor frame (18) which constitute the connection means (16) there are also provided holding segments (32, 33, 34, 35, 36) in said conductor frame 18 which are mechanically and electrically separated from the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46),

that parts of the holding segments (32, 33, 34, 35, 36) of said conductor frame (18) are connected to the holding foil (17) in order to hold the holding segments (32, 33, 34, 35, 36), and

that the holding segments (32, 33, 34, 35, 36) of said conductor frame terminate at the area of the periphery of the casing.

3. A device (1) as claimed in claim 1, characterized in that

the holding foil (17) is formed by a foil of polyimide.

4. A device (1) as claimed in claim 3, characterized in that

the holding foil (17) and the parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) are connected to one another by means of an adhesive layer (37) which is formed by a hot-melt adhesive.

5. A device (1) as claimed in claim 1, characterized in that

the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) are provided at least partly with a layer of silver on their peripheral surfaces which are remote from the holding foil (17).

6. A device (1) as claimed in claim 1, characterized in that

the conductor segments (20, 29, 24 and 21, 30, 23, 31) are arranged to connect a respective one of two chip terminals (9, 10) of the chip (7) to a respective one of two coil terminals (11, 12) of a transmission coil (8) which is suitable for contactless communication.

7. A device (1) as claimed in claim 6, characterized in that

the conductor segments (22, 29, 24 and 23, 31, 25) are additionally arranged to connected a respective one of the two chip terminals (9, 10) of the chip (7) to a respective one of two capacitor terminals (14, 15) of a capacitor (13).

8. A device (1) as claimed in claim 7, characterized in that

the conductor segments (24, 29, 22, 45, 42 and 25, 31, 23, 46, 43) are additionally arranged to connect a respective one of the two chip terminals (9, 10) of the chip (7) to a respective one of two resistor terminals of a resistor (44).

9. A data carrier (4) which is arranged for contactless communication with a communication station,

includes a casing (5) which consists of an electrically insulating material and is formed by injection molding, includes holding means (6) which are surrounded by the casing (5) and are arranged to hold a chip (7) and at least one passive component (8, 13;

44) which is suitable for contactless communication, and

is also provided with electrically conductive connection means (16) which are surrounded by the casing (5), thus being fully enclosed by the casing (5), are connected to the holding means (6), and by means of which a respective chip terminal (9, 10) of the chip (7) is electrically conductively connected to a respective component terminal (11, 12, 14, 15) of the at least one component (8, 13;

44),

characterized in that

the holding means (6) include a holding foil (17) of an electrically non-conductive synthetic material,

that the connection means (16) are realized while utilizing a conductor frame (18) consisting of metal,

that the connection means (16) are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) which are completely enclosed by the casing (5), and

that at least parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) are connected to the holding foil (17) in order to hold said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46).

10. A data carrier (4) as claimed in claim 9, characterized in that

in addition to the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) in said conductor frame (18) which constitute the connection means (16) there are also provided holding segments (32, 33, 34, 35, 36) in said conductor frame (18) which are mechanically and electrically separated from the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46),

that parts of the holding segments (32, 33, 34, 35, 36) of said conductor frame (18) are connected to the holding foil (17) in order to hold the holding segments (32, 33, 34, 35, 36), and

that the holding segments (32, 33, 34, 35, 36) of said conductor frame terminate at the area of the periphery of the casing.

11. A data carrier (4) as claimed in claim 9, characterized in that

the holding foil (17) is formed by a foil of polyimide.

12. A data carrier (4) as claimed in claim 11, characterized in that

the holding foil (17) and the parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) of said conductor frame (18) are connected to one another by means of an adhesive layer (37) which is formed by a hot-melt adhesive.

13. A data carrier (4) as claimed in claim 9, characterized in that

the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;

42, 43, 45, 46) are provided at least partly with a layer of silver on their peripheral surfaces which are remote from the holding foil (17).

14. A data carrier (4) as claimed in claim 9, characterized in that

the conductor segments (20, 29, 24 and 21, 30, 23, 31) are arranged to connect a respective one of two chip terminals (9, 10) of the chip (7) to a respective one of two coil terminals (11, 12) of a transmission coil (8) which is suitable for contactless communication.

15. A data carrier (4) as claimed in claim 14, characterized in that

the conductor segments (22, 29, 24 and 23, 31, 25) are additionally arranged to connect a respective one of the two chip terminals (9, 10) of the chip (7) to a respective one of two capacitor terminals (14, 15) of a capacitor (13).

16. A data carrier (4) as claimed in claim 15, characterized in that

the conductor segments (24, 29, 22, 45, 42 and 25, 31, 23, 46, 43) are additionally arranged to connect a respective one of the two chip terminals (9, 10) of the chip (7) to a respective one of two resistor terminals of a resistor (44).