Flat panel type display apparatuses having driver ICs formed on plate for holding display glasses

• US 6,275,220 B1
• Filed: 03/17/1998
• Issued: 08/14/2001
• Est. Priority Date: 03/17/1997
• Status: Expired due to Term

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Corporation
• Inventors: Nitta, Hideto
• Primary Examiner(s): WU, XIAO MIN
• Application Number:
  US09/042,732
• Time in Patent Office: 1,246 Days
• Field of Search: 345/204, 345/205, 345/206, 345/60, 345/61, 345/63, 345/64, 345/65, 345/66, 345/67, 345/69, 345/70, 313/587, 362/249, 361/697, 361/709, 361/711, 361/710, 361/720
• US Class Current: 345/204
• CPC Class Codes: H01J 2217/492 Details
• CPC Class Codes: H05K 7/20963 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20972 takes precedence

Abstract

A reinforcing plate for reinforcing a flat panel is extended from the peripheral part of the flat panel. Driver ICs are mounted in a TAB structure on a flexible printed wiring board one end of which is connected to the flat panel by a TAB and the other end is provided on the extended part of the reinforcing plate. The driver ICs are fixed on the reinforcing plate by adhering with a heat-conductive adhesive transcription tape.

Claims

1. An apparatus comprising:

a metal plate having a top surface, said top surface having a first portion, a second portion and a third portion between said first and second portion;

a first glass sheet formed on said first portion of said metal plate, said first glass sheet having an end portion on which an electrode is formed;

a second glass sheet formed on said first glass sheet;

a printed wiring board formed on said second portion of said metal plate and having at least one signal wiring line;

a chip formed on said third portion of said metal plate; and

a flexible printed wiring board connected between said printed wiring board and said chip and between said chip and said electrode of said first glass sheet.

2. The apparatus claimed in claim 1, wherein said metal plate is an aluminum alloy plate.

3. The apparatus claimed in claim 1, wherein said chip is connected to said metal plate by an adhesive having a heat-conductive characteristic.

4. The apparatus claimed in claim 1, wherein said chip is coupled to said flexible printed wiring board by a tape automated bonding.

5. An apparatus comprising:

a metal plate having a top surface and a bottom surface, said bottom surface having a first portion and a second portion, said second portion being closer to a peripheral portion of said metal plate than said first portion;

a first glass sheet formed on said top surface of said metal plate, said first glass sheet having an end portion on which an electrode is formed;

a second glass sheet formed on said first glass sheet;

a printed wiring board formed on said first portion of said metal plate and having at least one signal wiring line;

a IC chip formed on said second portion of said metal plate; and

a flexible printed wiring board connected between said printed wiring board and said IC chip and between said IC chip and said electrode such that said flexible printed wiring board goes around said peripheral portion of said metal plate.

6. The apparatus claimed in claim 5, wherein said metal plate is an aluminum alloy plate.

7. The apparatus claimed in claim 5, wherein said IC chip is connected to said metal plate by an adhesive having a heat-conductive characteristic.

8. The apparatus claimed in claim 5, wherein said IC chip is connected to said flexible printed wiring board by a tape automated bonding.

9. An display apparatus comprising:

a display panel including signal wiring lines arranged at a matrix on vertical and horizontal directions;

a reinforcing plate having a heat radiating characteristic adhered to said display panel, said plate having a first projecting portion projected from a first end of said display panel and a second projecting portion projected from a second end of said display panel, said first end of said display panel being perpendicular to said second end of said display panel;

a plurality of first wiring boards arranged on said first projecting portion of said plate, each of said first wiring boards having at least a first signal wire coupled to a corresponding one of said signal wiring lines arranged on said vertical direction;

a plurality of first IC chips formed on said first projecting portion of said plate, each of said first IC chips driving said first signal wire of a corresponding one of said first wiring boards;

a plurality of second wiring boards arranged on said second projecting portion of said plate, each of said second wiring boards having at least a second signal wire coupled to a corresponding one of said signal wiring lines arranged on said horizontal direction; and

a plurality of second IC chips formed on said second projecting portion of said plate, each of said second IC chips driving said second signal wire of a corresponding one of said second wiring boards.