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Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

  • US 6,275,381 B1
  • Filed: 12/10/1998
  • Issued: 08/14/2001
  • Est. Priority Date: 12/10/1998
  • Status: Expired due to Term
First Claim
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1. A thermal paste preform for assembly in a semiconductor package having a heat generating device and a heat dissipation device with a gap therebetween, the thermal paste preform comprising a slug of thermal paste material, said slug having a shape so as to substantially cover said heat generating device upon assembly in the semiconductor package, said slug having a slug thickness not less than the gap between the heat generating device and the heat dissipation device, said slug having a temperature and having stiffness and tackiness properties in accordance with the temperature thereof, so that the stiffness and tackiness properties of the slug facilitate shipping and storing of said thermal paste preform.

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