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Substrate removal as a function of acoustic analysis

  • US 6,277,656 B1
  • Filed: 09/30/1999
  • Issued: 08/21/2001
  • Est. Priority Date: 09/30/1999
  • Status: Expired due to Fees
First Claim
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1. A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising detecting acoustic energy propagating through the chip;

  • and removing a portion of substrate in the back side of the semiconductor chip as a function of detected acoustic energy propagating through the chip.

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