Substrate removal as a function of acoustic analysis
First Claim
1. A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising detecting acoustic energy propagating through the chip;
- and removing a portion of substrate in the back side of the semiconductor chip as a function of detected acoustic energy propagating through the chip.
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Accused Products
Abstract
A substrate removal approach involves sensing acoustic energy in an integrated circuit as a function of substrate in the integrated circuit being removed. According to an example embodiment of the present invention, a method for substrate removal includes removing a portion of substrate from the back side of a semiconductor chip circuitry near a circuit side and opposite the back side. The substrate is removed as a function of detected acoustic energy propagating through the device. The detected acoustic energy can be correlated to a parameter and used for controlling the substrate removal process, improving the ability to efficiently and accurately test semiconductor devices.
14 Citations
15 Claims
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1. A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising detecting acoustic energy propagating through the chip;
- and removing a portion of substrate in the back side of the semiconductor chip as a function of detected acoustic energy propagating through the chip.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for removing substrate from a semiconductor chip having a back side opposite circuitry near a circuit side, the method comprising the steps of:
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(A) detecting acoustic energy in the chip;
(B) removing substrate from the back side of the chip until a checkpoint is detected and in response thereto, adjusting the substrate removal rate;
(C) repeating step B until a final checkpoint is detected; and
(D) responsive to detecting the final checkpoint, terminating the removal process.
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Specification