Electronic single switch module

• US 6,278,199 B1
• Filed: 02/23/2000
• Issued: 08/21/2001
• Est. Priority Date: 02/25/1999
• Status: Expired due to Fees

• Current Assignee: ASBU Holdings, LLC
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Grant, William, Polack, Joshua
• Primary Examiner(s): Jackson, Stephen W.
• Assistant Examiner(s): POLK, SHARON A
• Application Number:
  US09/512,483
• Time in Patent Office: 545 Days
• Field of Search: 307/10.1, 307/10.6, 307/29, 307/131, 257/787, 257/788, 257/723, 257/724, 257/712, 257/713, 257/730, 257/731, 257/697, 257/698, 257/693, 257/668, 257/707
• US Class Current: 307/10.1
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

An electronic module is provided using one or more field effect transistors (FETs) arranged on a conductive plate such that the module is capable of switching very high currents while remaining compact and still providing excellent thermal management properties. A plurality of conductive plates are bonded with an insulating material, the insulating material also forms a housing. One or more FETs are arranged inside the housing on one of the plates such that an electrical connection is made between a first region of the FET and the plate. A second FET region is electrically connected to another conductive plate. A circuit board is contained within the housing in which an electrical connection is made between the second region and the circuit board, and between a third FET region and the circuit board.

Claims

1. An electronic switch module, comprising:

an interlocking base plate, the base plate including;

a first electrically conductive element; and

a second electrically conductive element arranged in an interlocking position with respect to the first electrically conductive element but not making physical contact with the same;

the first electrically conductive element and the second electrically conductive element arranged in a planar relationship with respect to each other;

a housing, the housing defining an inner volume and being comprised of an insulating material, the housing being formed to affix the first electrically conductive element and the second electrically conductive clement in the planar arrangement so that the first electrically conductive element and the second electrically conductive element interlock through the housing without making physical contact;

at least one semiconductor die, the at least one semiconductor die having;

a first side mounted to and in electrical contact with one of the first and second electrically conductive elements; and

a second side electrically coupled to the other of the first and second electrically conductive elements.

2. The module according to claim 1, wherein the at least one semiconductor device in a field effect transistor.

3. The module according to claim 2, wherein the field effect transistors are implemented on size four dice and the module is arranged to switch an electric current in excess of one thousand amperes.

4. An electronic switch module, comprising:

an interlocking base plate, the base plate including;

a first electrically conductive element; and

a second electrically conductive element arranged in an interlocking position with respect to the first electrically conductive element but not making physical contact with the same;

the first electrically conductive element and the second electrically conductive element arranged in a planar relationship with respect to each other;

a housing, the housing, defining an inner volume and being comprised of an insulating material, the housing being formed to affix the first electrically conductive element and the second electrically conductive element in the planar arrangement so that the first electrically conductive element and the second electrically conductive element interlock through the housing without making physical contact;

at least one semiconductor die, the at least one semiconductor die having;

a first side mounted to and in electrical contact with one of the first and second electrically conductive elements; and

a second side electrically coupled to the other of the first and second electrically conductive elements;

wherein the first and second electrically conductive elements each include nibs arranged on at least a part of a periphery of the first and second electrically conductive elements.

5. The module according to claim 4, wherein the nibs are molded within the insulating material.

6. The module according to claim 5, wherein the nibs extend upward and outward from at least one of the first and second electrically conductive elements.

7. The module according to claim 6, wherein the first and second electrically conductive elements each include a first side and a second side opposite the first side, at least a part of the first side of the first electrically conductive element and at least a part of the first side of the second electrically conductive element being wider than their respective second sides.

8. The module according to claim 5, wherein the nibs are symmetrical around a plane centrally positioned between the first side and the second side of each of the first and second electrically conductive elements.

9. The module according to claim 8, wherein a thickness of the nibs is less than a thickness of the first and second electrically conductive elements.

10. The module according to claim 5, wherein the nibs along respective interlocking portions form an approximately contiguous piece longitudinally along the at least a part of the periphery of the first and second electrically conductive elements.

11. The module according to claim 5, wherein the nibs are approximately contiguous along the periphery of the interlocking portion of both of the first and second electrically conductive elements.

12. The module according to claim 11, wherein the nibs extend upward and outward from at least one of the first and second electrically conductive elements.

13. The module according to claim 11, wherein the nibs are symmetrical around a plane centrally positioned between the first side and the second side of each of the first and second electrically conductive elements.

14. The module according to claim 4, further comprising a printed circuit board, the printed circuit board being positioned within the inner volume of the housing and being in electrical contact with the at least one semiconductor die.

15. The module according to claim 4, wherein the module is incorporated within an internal combustion engine.

16. The module according to claim 4, wherein a plurality of modules are electrically interconnected to create a switch interconnected to create a large-scale three phase inverter structure.

17. An electronic switch module for use in an internal combustion engine, comprising:

an interlocking base plate, the base plate including;

an electrically conductive plug element; and

an electrically conductive receptacle element arranged in an interlocking position with respect to the electrically conductive plug element but not making physical contact with the same;

the electrically conductive plug clement and the electrically conductive receptacle element arranged in a planar relationship with respect to each other;

a housing, the housing defining an inner volume and being comprised of an insulating material, the housing being formed to affix the electrically conductive plug element and the electrically conductive receptacle element in the planar arrangement so that the electrically conductive plug element and the electrically conductive receptacle element interlock through the housing without making physical contact;

at least one semiconductor die, the at least one semiconductor die having;

a first side mounted to and in electrical contact with one of the electrically conductive plug and receptacle elements; and

a second side electrically coupled to the other of the electrically conductive plug and receptacle elements.

18. The module according to claim 17, wherein the at least one semiconductor is a field effect transistor.

19. An electronic switch module for use in an internal combustion engine, comprising:

an interlocking base plate, the base plate including;

an electrically conductive plug element; and

an electrically conductive receptacle element arranged in an interlocking position with respect to the electrically conductive plug element without making physical contact with the same;

the electrically conductive plug element and the electrically conductive receptacle element arranged in a planar relationship with respect to each other;

a housing, the housing defining an inner volume and being comprised of an insulating material, the housing being formed to affix the electrically conductive plug element and the electrically conductive receptacle element in the planar arrangement so that the electrically conductive plug element and the electrically conductive receptacle element interlock through the housing without making physical contact;

at least one semiconductor die, the at least one semiconductor die having;

a first side mounted to and in electrical contact with one of the electrically conductive plug and receptacle elements; and

a second side electrically coupled to the other of the electrically conductive plug and receptacle elements;

wherein the at least one semiconductor is a field effect transistor, and

the electrically conductive plug element is formed in the shape of a “

T” and

the electrically conductive receptacle element is formed in the shape of a “

U”

.

20. The module according to claim 19, wherein the at least one field effect transistor is mounted to the electrically conductive plug element.

21. The module according to claim 20, further comprising a printed circuit board, the printed circuit board being:

positioned within the inner volume of the housing;

in electrical contact with the at least one semiconductor die; and

mounted to the electrically conductive plug element.

22. The module according to claim 19, wherein the at least one field effect transistor is mounted to the electrically conductive receptacle element.

23. The module according to claim 19, wherein the electrically conductive plug and receptacle elements each include nibs arranged on at least a part of a periphery of the electrically conductive plug and receptacle elements, and wherein the nibs are molded within the insulating material.

24. The module according to claim 23, wherein the nibs extend upward and outward from at least one of the electrically conductive plug and receptacle elements.

25. The module according to claim 23, wherein each of the electrically conductive plug and receptacle elements include a first side and a second side opposite the first side, and wherein the nibs are symmetrical around a plane centrally positioned between the first side and the second side of each of the electrically conductive plug and receptacle elements.