Methods for forming assemblies

• US 6,281,038 B1
• Filed: 03/16/1999
• Issued: 08/28/2001
• Est. Priority Date: 02/05/1999
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Craig, Gordon S. W., Jacobsen, Jeffrey Jay, Hadley, Mark A.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): LE, DUNG ANH
• Application Number:
  US09/270,165
• Time in Patent Office: 896 Days
• Field of Search: 438/106, 438/107, 438/110, 438/455, 438/457, 438/480, 294/53, 156/665.1
• US Class Current: 438/106
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H10K 59/129 : Chiplets

Abstract

Methods and devices are claimed wherein blocks with integrated circuits thereon are rolled or pressed into recessed regions of a flexible or rigid substrate which is used in forming displays. Rolling the blocks into the substrate may take place in either a batch operation or in a continuous process.

Claims

1. A method for fabricating an assembly, said method comprising:

dispensing a slurry over a substrate, said slurry containing a plurality of shaped

blocks which are deposited onto recessed regions of the substrate; and

pressing said plurality of shaped blocks into the substrate.

2. The method as in claim 1 wherein said substrate is flexible.

3. The method as in claim 1 wherein said substrate is rigid.

4. The method as in claim 1 wherein the substrate is heated.

5. The method as in claim 1 wherein a roller is used to press the plurality of blocks into the recessed regions of the substrate.

6. The method as in claim 5 wherein nonstick material is placed between the roller and the substrate.

7. The method as in claim 6 wherein the nonstick material is selected from the group consisting of polyethylene, polyester, tetrafluoroethylene, polytetrafluoroethylene, perfluorinated ethylenepropylene, polyfluoroethylene, copolymer of tetrafluoroethylene with (perfluoro)alkyl-vinyl ether, perfluoroalkoxyl, perfluoroalkoxy polymer, perfluoroalkylvinyl ether, copolymer, perfluorovinylalkylethertetrafluoroethylene copolymer, perfluoroalkoxyethylene, co-polytetrafluoroethylene-perfluoroalkoxy, FEP, PTFE, and PVDF.

8. The method as in claim 1 wherein the assembly has at least one organic light emitting diode.

9. A method of pressing shaped blocks into recessed regions in a substrate, said method comprising:

moving a substrate through at least one web process apparatus;

dispensing a slurry containing a plurality of shaped blocks onto said flexible substrate, said shaped blocks being deposited onto recessed regions of said substrate; and

pressing said plurality of shaped blocks into said substrate.

10. The method as in claim 9 wherein said substrate moves at a rate of 5 inches per minute to 100 inches per minute.

11. The method in claim 9 wherein a display tape moves at a rate of 5 inches per minute to 100 inches per minute.

12. The method as in claim 9 wherein the substrate is rolled at the rate of 5 inches per minute to 100 inches per minute.

13. The method as in claim 11 wherein the display tape comprises a material selected from the group of polyether sulfone, polyethylene terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, nylon, polyamide-imide, polyimide, aromatic polyimides, polyetherimide, metallic materials, acrylonitrile butadiene styrene, and polyvinyl chloride.