Corrosion-resistant polishing pad conditioner
DC
First Claim
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1. A method of manufacturing a semiconductor device, comprising:
- polishing a semiconductor wafer with a chemical/mechanical slurry against a polishing pad, the polishing forming variations in a polishing surface of the polishing pad; and
conditioning the polishing surface with a polishing pad conditioning wheel comprising;
a conditioning head having opposing first and second faces, the first face coupleable to a polishing apparatus;
a setting alloy coupled to the conditioning head at the second face;
abrasive material embedded in the setting alloy; and
a corrosion resistant coating affixed to the setting alloy.
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Abstract
The present invention provides a method of manufacturing a semiconductor device using a polishing apparatus having a polishing pad conditioning wheel. In one embodiment, the polishing pad conditioning wheel comprises a conditioning head, a setting alloy, an abrasive material, and a corrosion resistant coating. The conditioning head has opposing first and second faces with the first face being coupleable to the polishing apparatus. The setting alloy is coupled to the conditioning head at the second face, and the abrasive material is embedded in the setting alloy, which is substantially covered by the corrosion resistant coating.
36 Citations
9 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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polishing a semiconductor wafer with a chemical/mechanical slurry against a polishing pad, the polishing forming variations in a polishing surface of the polishing pad; and
conditioning the polishing surface with a polishing pad conditioning wheel comprising;
a conditioning head having opposing first and second faces, the first face coupleable to a polishing apparatus;
a setting alloy coupled to the conditioning head at the second face;
abrasive material embedded in the setting alloy; and
a corrosion resistant coating affixed to the setting alloy. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
Inconel®
718,Inconel®
718 LC,Hastelloy®
,Illium-R®
,309 Stainless Steel, 347 Stainless Steel, 430 Stainless Steel, and 18-8 Stainless Steel.
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8. The method as recited in claim 1 wherein conditioning includes conditioning with an abrasive material comprising diamonds.
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9. A method for manufacturing an integrated circuit, comprising:
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forming active devices on a semiconductor wafer and forming a substrate over the active devices;
positioning a semiconductor wafer in a polishing apparatus having a polishing surface, the polishing surface having been conditioned with a polishing pad conditioning wheel comprising;
a conditioning head having opposing first and second faces, the first face coupleable to the polishing apparatus;
a setting alloy coupled to the conditioning head at the second face;
abrasive material embedded in the setting alloy; and
a corrosion resistant coating affixed to the setting alloy; and
polishing the substrate against the polishing surface using the slurry.
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Specification
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Litigation Data
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Current AssigneeBell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
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Original AssigneeAgere Systems Guardian Corp. (Broadcom, Inc.)
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InventorsMerchant, Sailesh M., Easter, William G., Maze, John A.
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Primary Examiner(s)Utech, Benjamin L.
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Assistant Examiner(s)DEO, DUY VU NGUYEN
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Application NumberUS09/399,621Time in Patent Office708 DaysField of Search438/691, 438/692, 438/693, 451/56, 451/72, 451/910, 427/249.8, 427/249.11, 427/249.12US Class Current438/691CPC Class CodesB24B 53/017 Devices or means for dressi...B24B 53/12 Dressing tools; Holders the...B24D 3/06 metallic or mixture of meta...
