Apparatus and method for applying process solution

• US 6,281,145 B1
• Filed: 05/14/1999
• Issued: 08/28/2001
• Est. Priority Date: 06/05/1998
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Deguchi, Masatoshi, Yoshihara, Kosuke
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Ghyka, Alexander G.
• Application Number:
  US09/312,542
• Time in Patent Office: 837 Days
• Field of Search: 438/782, 438/758, 118/52, 118/64, 118/313
• US Class Current: 438/782
• CPC Class Codes: B05C 11/08 Spreading liquid or other fluent material by manipulating the work, e.g. tilting
• CPC Class Codes: G03F 7/162 Coating on a rotating support, e.g. using a whirler or a spinner
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.

Claims

1. A process solution applying apparatus comprising:

a spin holder configured to hold a substrate;

a plurality of supply systems configured to supply different types of process solutions to the substrate held by the spin holder, each of the supply systems having a supply mechanism configured to change a rate at which a process solution is supplied;

a spin driver configured to rotate the spin holder, thereby rotating the substrate to spread a process solution by virtue of centrifugal force and to coat the substrate with the process solution; and

a controller configured to control the supply systems, the controller having a storage section which stores data representing relationships between the process solutions and supply rates prescribed for the same, a selection section for selecting a process solution to be used from the process solutions, and a control section which selects a supply system corresponding to the selected process solution, and drives the supply mechanism of the selected supply system at a supply rate prescribed for the selected process solution.

2. The apparatus according to claim 1, wherein each supply rate has such a value that the corresponding process solution applied in a certain amount forms a process solution film having a uniform thickness on an entire surface of the substrate.

3. The apparatus according to claim 2, wherein the process solutions are different types of resist solutions, and the certain amount for forming the process solution film is set to be 2.0 ml or less.

4. The apparatus according to claim 1, wherein each supply mechanism has a positive-displacement pump for drawing and discharging a process solution, and a stepping motor for driving the positive-displacement pump and changing a rate of discharging the process solution when controlled in terms of rotation speed.

5. The apparatus according to claim 1, wherein each supply system has a replaceable supply tank storing a process solution, and the supply mechanism of the supply system has a detecting section for detecting the amount of the process solution remaining in the supply tank, in accordance with operation of the supply system.

6. The apparatus according to claim 1, wherein each supply system has a replaceable filter through which a process solution passes, and the supply mechanism of the supply system has a detecting section for detecting the time at which the filter is to be replaced, in accordance with operation of the supply system.

7. The apparatus according to claim 1, wherein the supply system further comprises respective nozzles for supplying a process solution, the apparatus further comprises a waiting section disposed outside the spin holder, for placing the nozzles, and a transfer system configured to pick up one of the nozzles from the waiting section and transfer the nozzle to a position above the substrate, and the controller is configured to drive the transfer system to transfer a nozzle corresponding to the selected supply system.

10. The apparatus according to claim 1, wherein each supply mechanism has a positive-displacement pump for drawing and discharging a resist solution, and a stepping motor for driving the positive-displacement pump and changing a rate of discharging the resist solution when controlled in terms of rotation speed.

11. The apparatus according to claim 1, wherein each supply system has a replaceable supply tank storing a resist solution, and the supply mechanism of the supply system has a detecting section for detecting the amount of the resist solution remaining in the supply tank, in accordance with operation of the supply system.

12. The apparatus according to claim 1, wherein each supply system has a replaceable filter through which a resist solution passes, and the supply mechanism of the supply system has a detecting section for detecting the time at which the filter is to be replaced, in accordance with operation of the supply system.

8. A resist solution applying apparatus comprising:

a spin holder configured to hold a substrate;

a plurality of supply systems configured to supply different types of resist solutions to the substrate held by the spin holder, each of the supply systems having a nozzle configured to supply a resist solution, and a supply mechanism configured to change a rate at which a resist solution is supplied;

a spin driver configured to rotate the spin holder, thereby rotating the substrate to spread a resist solution by virtue of centrifugal force and to coat the substrate with the resist solution;

a waiting section disposed outside the spin holder, for placing the nozzles;

a transfer system configures to pick up one of the nozzles from the waiting section and transfer the nozzle to a position above the substrate; and

a controller configured to control the supply systems and the transfer system, the controller having a storage section which stores data representing relationships between the resist solutions and supply rates prescribed for the same, a selection section for selecting a resist solution to be used from the resist solutions, and a control section which selects a supply system corresponding to the selected resist solution, drives the transfer system to transfer a nozzle corresponding to the selected supply system, and drives the supply mechanism of the selected supply system at a supply rate prescribed for the selected resist solution, wherein each supply rate has such a value that the corresponding resist solution applied in a certain amount forms a resist solution film having a uniform thickness on an entire surface of the substrate.

9. The apparatus according to claim 8, wherein the certain amount for forming the resist solution film is set to be 2.0 ml or less.