Energy-efficient, laser-based method and system for processing target material

• US 6,281,471 B1
• Filed: 12/28/1999
• Issued: 08/28/2001
• Est. Priority Date: 12/28/1999
• Status: Expired due to Term

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: GSI Lumonics, Inc.
• Inventors: Smart, Donald V.
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US09/473,926
• Time in Patent Office: 609 Days
• Field of Search: 219/121.6, 219/121.61, 219/121.62, 219/121.67, 219/121.68, 219/121.69, 219/121.7, 219/121.71, 219/121.72
• US Class Current: 219/121.62
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/0736 into an oval shape, e.g. elliptic shape
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/76894 using a laser, e.g. laser cutting, laser direct writing, laser repair
• CPC Class Codes: H01L 23/5258 the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 438/94 Laser ablative material removal
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses. The amplified pulses have little distortion and have substantially the same relative temporal power distribution as the original pulse train from the laser. Each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time. The system further includes a beam delivery and focusing subsystem for delivering and focusing at least a portion of the amplified pulse train onto the target material. The rise time (less than about 1 ns) is fast enough to efficiently couple laser energy to the target material, the pulse duration (typically 2-10 ns) is sufficient to process the target material, and the fall time (a few ns) is rapid enough to prevent the undesirable changes to the material surrounding the target material.

Claims

1. An energy-efficient, laser-based method for processing target material having a specified dimension in a microscopic region without causing undesirable changes in electrical or physical characteristics of material surrounding the target material, the method comprising:

generating a laser pulse train utilizing a laser having a wavelength at a repetition rate wherein each of the pulses of the pulse train has a predetermined shape;

optically amplifying the pulse train without significantly changing the predetermined shape of the pulses to obtain an amplified pulse train wherein each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time; and

delivering and focusing at least a portion of the amplified pulse train into a spot on the target material wherein the rise time is fast enough to efficiently couple laser energy to the target material, the pulse duration is sufficient to process the target material and the fall time is rapid enough to prevent the undesirable changes to the material surrounding the target material.

2. The method as claimed in claim 1 wherein the target material includes microstructures.

3. The method as claimed in claim 2 wherein the microstructures are conductive lines.

4. The method as claimed in claim 3 wherein the conductive lines are metal lines and wherein the pulse duration is sufficient to effectively heat and vaporize a specified portion of the metal lines.

5. The method as claimed in claim 1 wherein the target material is a part of a semiconductor device.

6. The method as claimed in claim 5 wherein the semiconductor is a semiconductor memory.

7. The method as claimed in claim 6 wherein the memory has a density of at least 16 and up to 256 megabits.

8. The method as claimed in claim 1 wherein at least a portion of the material surrounding the target material is a substrate.

9. The method as claimed in claim 8 wherein the substrate is a semiconductor substrate.

10. The method as claimed in claim 1 wherein the target material is part of a microelectronic device.

11. The method as claimed in claim 5 wherein the semiconductor is a microelectromechanical device.

12. The method as claimed in claim 1 wherein the substantially square temporal power density distribution is sufficient to substantially completely ablate the target material.

13. The method as claimed in claim 1 wherein the rise time is less than 1 nanosecond.

14. The method as claimed in claim 13 wherein the rise time is less than 0.5 nanoseconds.

15. The method as claimed in claim 1 wherein the pulse duration is less than 10 nanoseconds.

16. The method as claimed in claim 15 wherein the pulse duration is less than 5 nanoseconds.

17. The method as claimed in claim 1 wherein the fall time is less than 2 nanoseconds.

18. The method as claimed in claim 1 wherein a single amplified pulse is sufficient to process the target material.

19. The method as claimed in claim 1 wherein the target material has a reflectivity to the amplified pulses and wherein the power density of the amplified pulses is sufficiently high to reduce the reflectivity of the target material to the amplified pulses and to provide efficient coupling of the laser energy to the target material.

20. The method as claimed in claim 1 wherein each amplified pulse has a relatively uniform power density distribution throughout the pulse duration.

21. The method as claimed in claim 1 wherein each pulse has a temporal power density distribution uniform to within ten percent during the pulse duration.

22. The method as claimed in claim 1 wherein the material surrounding the target material has optical properties and thermal diffusivity properties different from the corresponding properties of the target material.

23. The method as claimed in claim 22 wherein the optical properties include absorption.

24. The method as claimed in claim 22 wherein the optical properties include polarization sensitivity.

25. The method as claimed in claim 1 wherein the repetition rate is at least 1000 pulses/second.

26. The method as claimed in claim 1 wherein each of the amplified pulses has at least 0.1 and up to 3 microjoules of energy.

27. The method as claimed in claim 1 wherein the step of optically amplifying provides a gain of at least 20 DB.

28. The method as claimed in claim 1 wherein both the rise time and the fall time are less than one-half of the pulse duration and wherein peak power of each amplified pulse is substantially constant between the rise and fall times.

29. The method as claimed in claim 1 wherein each of the amplified pulses has a tail and further comprising attenuating laser energy in the tails of the amplified pulses to reduce fall time of the amplified pulses while substantially maintaining the amount of power of the pulses.

30. The method as claimed in claim 29 wherein the attenuated laser energy in the tails is attenuated by at least 20 dB within 1.5 times the pulse duration.

31. The method as claimed in claim 1 wherein the pulse duration is a function of the specified dimension.

32. The method as claimed in claim 1 wherein the specified dimension is less than the laser wavelength.

33. The method as claimed in claim 1 wherein the laser is a high speed, semiconductor laser diode.

34. The method as claimed in claim 33 wherein the laser diode has a wavelength less than about 2 μ

m.

35. The method as claimed in claim 1 wherein the spot has a dimension in the range of about 1 μ

m-4 μ

m.

36. The method as claimed in claim 33 wherein the laser diode is a multimode diode laser.

37. The method as claimed in claim 33 wherein the laser diode is a single frequency laser diode utilizing a distributed Bragg reflector (DBR), distributed feedback (DFB), or an external cavity design.

38. An energy-efficient system for processing target material having a specified dimension in a microscopic region without causing undesirable changes in electrical or physical characteristics of material surrounding the target material, the system comprising:

a controller for generating a processing control signal;

a signal generator for generating a modulated drive waveform based on the processing control signal, wherein the waveform has a sub-nanosecond rise time;

a gain-switched, pulsed seed laser having a wavelength for generating a laser pulse train at a repetition rate, the drive waveform pumping the laser so that each pulse of the pulse train has a predetermined shape;

a laser amplifier for optically amplifying the pulse train without significantly changing the predetermined shape of the pulses to obtain an amplified pulse train wherein each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time; and

a beam delivery and focusing subsystem for delivering and focusing at least a portion of the amplified pulse train into a spot on the target material wherein the rise time is fast enough to efficiently couple laser energy to the target material, the pulse duration is sufficient to process the target material, and the fall time is rapid enough to prevent the undesirable changes to the material surrounding the target material.

39. The system as claimed in claim 38 wherein the target material includes microstructures.

40. The system as claimed in claim 39 wherein the microstructures are conductive lines.

41. The system as claimed in claim 40 wherein the conductive lines are metal lines and wherein the pulse duration is sufficient to effectively heat and vaporize a specified portion of the metal lines.

42. The system as claimed in claim 38 wherein the target material is a part of a semiconductor device.

43. The system as claimed in claim 42 wherein the semiconductor is a semiconductor memory.

44. The system as claimed in claim 43 wherein the memory has a density of at least 16 and up to 256 megabits.

45. The system as claimed in claim 38 wherein at least a portion of the material surrounding the target material is a substrate.

46. The system as claimed in claim 45 wherein the substrate is a semiconductor substrate.

47. The system as claimed in claim 42 wherein the semiconductor is a microelectromechanical device.

48. The system as claimed in claim 38 wherein the target material is part of a microelectronic device.

49. The system as claimed in claim 38 wherein the substantially square temporal power density distribution is sufficient to substantially completely ablate the target material.

50. The system as claimed in claim 38 wherein the rise time is less than 1 nanosecond.

51. The system as claimed in claim 50 wherein the rise time is less than 0.5 nanoseconds.

52. The system as claimed in claim 38 wherein the pulse duration is less than 10 nanoseconds.

53. The system as claimed in claim 52 wherein the pulse duration is less than 5 nanoseconds.

54. The system as claimed in claim 38 wherein the fall time is less than 2 nanoseconds.

55. The system as claimed in claim 38 wherein a single amplified pulse is sufficient to process the target material.

56. The system as claimed in claim 38 wherein the target material has a reflectivity to the amplified pulses and wherein the power density of the amplified pulses is sufficiently high to reduce the reflectivity of the target material to the amplified pulses and to provide efficient coupling of the laser energy to the target material.

57. The system as claimed in claim 38 wherein each amplified pulse has a relatively uniform power density distribution throughout the pulse duration.

58. The system as claimed in claim 38 wherein the material surrounding the target material has optical properties and thermal diffusivity properties different from the corresponding properties of the target material.

59. The system as claimed in claim 58 wherein the optical properties include absorption.

60. The system as claimed in claim 58 wherein the optical properties include polarization sensitivity.

61. The system as claimed in claim 38 wherein the repetition rate is at least 1000 pulses/second.

62. The system as claimed in claim 38 wherein each of the amplified pulses has at least 0.1 and up to 3 microjoules of energy.

63. The system as claimed in claim 38 wherein the step of optically amplifying provides a gain of at least 20 DB.

64. The system as claimed in claim 38 wherein both the rise time and the fall time are less than one-half of the pulse duration and wherein peak power of each amplified pulse is substantially constant between the rise and fall times.

65. The system as claimed in claim 38 wherein the laser amplifier includes an optical fiber and a pump to pump the optical fiber wherein the pump is distinct from the seed laser.

66. The system as claimed in claim 65 wherein the pump is a laser diode.

67. The system as claimed in claim 38 wherein the seed laser includes a laser diode.

68. The system as claimed in claim 38 wherein each pulse has a temporal power density distribution uniform to within ten percent during the pulse duration.

69. The system as claimed in claim 38 wherein each of the amplified pules has a tail and further comprising an attenuator for attenuating laser energy in the tails of the amplified pulses to reduce fall time of the amplified pulses while substantially maintaining the amount of power of the pulses.

70. The system as claimed in claim 69 wherein the attenuator attenuates laser energy in the tails by at least 10 dB within 1.5 times the pulse duration.

71. The system as claimed in claim 38 wherein the pulse duration is a function of the specified dimension.

72. The system as claimed in claim 38 wherein the specified dimension is less than the wavelength.

73. The system as claimed in claim 67 wherein the laser diode has a wavelength less than about 2 μ

m.

74. The system as claimed in claim 38 wherein the spot has a dimension in the range of about 1 μ

m-4 μ

m.

75. The system as claimed in claim 67 wherein the laser diode is a multimode diode laser.

76. The system as claimed in claim 67 wherein the laser diode is a single frequency laser diode utilizing a distributed Bragg reflector (DBR), distributed feedback (DFB), or an external cavity design.

77. The system as claimed in claim 65 wherein the pump is a gain-switched laser diode.

78. The system as claimed in claim 38 further comprising an optical switch and a computer coupled to the optical switch and the subsystem for selecting material processing pulses of the pulse train and to control position of the selected pulses relative to the target material.

79. The system as claimed in claim 65 wherein the optical fiber is a single mode optical fiber and the pump is a pump diode.

80. An energy-efficient, laser-based method for ablating a metal link having a specified dimension embedded in at least one passivation layer without causing undesirable changes in electrical or physical characteristics of the at least one passivation layer surrounding the metal link, the method comprising:

generating a laser pulse train utilizing a laser having a wavelength at a repetition rate wherein each of the pulses of the pulse train has a predetermined shape;

optically amplifying the pulse train without significantly changing the predetermined shape of the pulses to obtain an amplified pulse train wherein each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time; and

delivering and focusing at least a portion of the amplified pulse train into a spot on the metal link wherein the rise time is fast enough to efficiently couple laser energy to the metal link, the pulse duration is sufficient to ablate the metal link and the fall time is rapid enough to prevent the undesirable changes to the at least one passivation layer surrounding the metal link.

81. The method as claimed in claim 80 wherein the metal link is embedded in a top passivation layer thereover and a bottom passivation layer thereunder and wherein the pulse duration is sufficient to crack the top passivation layer but not the bottom passivation layer.

82. An energy-efficient system for ablating a metal link having a specified dimension embedded in at least one passivation layer without causing undesirable changes in electrical or physical characteristics of the at least one passivation layer surrounding the metal link, the system comprising:

a controller for generating a processing control signal;

a signal generator for generating a modulated drive waveform based on the processing control signal, wherein the waveform has a sub-nanosecond rise time;

a gain-switched, pulsed seed laser having a wavelength for generating a laser pulse train at a repetition rate, the drive waveform pumping the laser so that each pulse of the pulse train has a predetermined shape;

a laser amplifier for optically amplifying the pulse train without significantly changing the predetermined shape of the pulses to obtain an amplified pulse train wherein each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time; and

a beam delivery and focusing subsystem for delivering and focusing at least a portion of the amplified pulse train into a spot on the metal link wherein the rise time is fast enough to efficiently couple laser energy to the metal link, the pulse duration is sufficient to ablate the metal link, and the fall time is rapid enough to prevent the undesirable changes to the at least one passivation layer surrounding the metal link.

83. The system as claimed in claim 82 wherein the metal link is embedded in a top passivation layer thereover and a bottom passivation layer thereunder and wherein the pulse duration is sufficient to crack the top passivation layer but not the bottom passivation layer.