Resin package fabrication process

• US 6,282,781 B1
• Filed: 12/17/1998
• Issued: 09/04/2001
• Est. Priority Date: 12/18/1997
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Gotoh, Masashi, Kanazawa, Jitsuo, Yamamoto, Syuichiro
• Primary Examiner(s): Arbes, Carl J.
• Assistant Examiner(s): Trinh, Minh
• Application Number:
  US09/212,863
• Time in Patent Office: 992 Days
• Field of Search: 298/41, 298/42, 298/48, 297/40, 297/39, 298/32, 264/272.17, 174/52.2, 174/52.4
• US Class Current: 29/841
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01065 Terbium [Tb]
• CPC Class Codes: H01L 2924/01073 Tantalum [Ta]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.

Claims

1. A resin package fabrication process, comprising:

machining a resin substrate comprising a thermosetting resin to provide a machined substrate;

a first heating of said machined substrate to a first temperature equal to or greater than an original glass transition temperature of said resin substrate, thereby providing said resin substrate with a second glass transition temperature higher than said original glass transition temperature;

placing a resin layer on at least a portion of said resin substrate having said second glass transition temperature; and

a second heating of said resin substrate having said resin layer on at least a portion thereof to a second temperature, wherein said second temperature is equal to said original glass transition temperature or between said original glass transition temperature and said second glass transition temperature, to thereby fix said resin layer to said resin substrate.

2. The resin package fabrication process according to claim 1, further comprising:

mounting one or more electronic components on said resin substrate upon said first heating,

wherein said step of placing a resin layer is performed such that said resin layer is placed on at least a portion of said resin substrate having said one or more electronic components mounted thereon.

3. The resin package fabrication process according to claim 2, wherein said step of placing a resin layer on said resin substrate is carried out using a lid member, wherein said lid member is bonded to said resin substrate by said second heating such that said one or more electronic components are sealed up.

4. The resin package fabrication process according to claim 3, wherein said resin substrate comprises a first resin substrate on which one or more electronic components are mounted by means of a bump, and a second resin substrate acting as a lid member for said first resin substrate and covering said first resin substrate to form a cavity in which said one or more electronic components are contained, and wherein said resin layer is between said first resin substrate and said second resin substrate, such that upon said second heating step, said one or more electronic components are sealed up by said resin layer.