Grinding machine

• US 6,283,837 B1
• Filed: 06/18/1999
• Issued: 09/04/2001
• Est. Priority Date: 08/20/1998
• Status: Expired due to Fees

• Current Assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG
• Original Assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG
• Inventors: Vorbuchner, Robert
• Primary Examiner(s): Hail, III, Joseph J.
• Assistant Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US09/335,665
• Time in Patent Office: 809 Days
• Field of Search: 451/49, 451/57-58, 451/5, 451/242, 451/65, 451/66, 451/41, 451/362
• US Class Current: 451/58
• CPC Class Codes: B23Q 1/26 characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members bearings for linearly moving parts F16C29/00
• CPC Class Codes: B24B 41/04 Headstocks; Working-spindles; Features relating thereto
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence
• CPC Class Codes: B24B 5/045 with the grinding wheel axis perpendicular to the workpiece axis
• CPC Class Codes: B24B 5/50 characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings cutting profiles into the treads of tyres B29D30/68

Abstract

A grinding machine has a swivel head (1) with at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the workpiece.

Claims

1. A method for grinding a semiconductor bar, and said semiconductor bar having a length and a diameter, comprising

providing a swivel head (1) having at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the semiconductor bar;

pivoting the swivel head (1) through 180°

, wherein it is possible for either the plunge-grinding wheel (2) or the cup wheel (3) to grind the semiconductor bar (6); and

grinding the semiconductor bar (6) by plunge grinding and by cup grinding.

2. The method for grinding a semiconductor bar as claimed in claim 1, comprising

measuring the length of the semiconductor bar (6).

3. The method for grinding a semiconductor bar as claimed in claim 1, comprising

rotating the semiconductor bar;

and

measuring the diameter over the length of the rotating semiconductor bar (6).

4. The method for grinding a semiconductor bar as claimed in claim 1 comprising

first plunge grinding said bar;

and

then cup grinding said bar.