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Metalization outside protective overcoat for improved capacitors and inductors

  • US 6,284,617 B1
  • Filed: 02/02/2001
  • Issued: 09/04/2001
  • Est. Priority Date: 11/05/1997
  • Status: Expired due to Term
First Claim
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1. A fabrication method, comprising the steps of:

  • (a.) forming a first circuit portion which includes a first electrode of a capacitor;

    (b.) covering said first circuit portion with a protective overcoat;

    (c.) forming openings through said protective overcoat including bond pad openings and an opening at said first electrode;

    (d.) depositing a capacitor dielectric over exposed portions of said first electrode; and

    (e.) forming a second electrode of said capacitor overlying said first electrode, said second electrode at least partially overlying said protective overcoat.

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