Metalization outside protective overcoat for improved capacitors and inductors
First Claim
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1. A fabrication method, comprising the steps of:
- (a.) forming a first circuit portion which includes a first electrode of a capacitor;
(b.) covering said first circuit portion with a protective overcoat;
(c.) forming openings through said protective overcoat including bond pad openings and an opening at said first electrode;
(d.) depositing a capacitor dielectric over exposed portions of said first electrode; and
(e.) forming a second electrode of said capacitor overlying said first electrode, said second electrode at least partially overlying said protective overcoat.
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Abstract
A thick layer of copper is formed on the outside the protective overcoat (PO) which protects an integrated circuit, and forms both an inductor and the upper electrode of a capacitor. Placing this layer outside the PO greatly reduces parasitic capacitances with the substrate in the devices.
25 Citations
1 Claim
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1. A fabrication method, comprising the steps of:
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(a.) forming a first circuit portion which includes a first electrode of a capacitor;
(b.) covering said first circuit portion with a protective overcoat;
(c.) forming openings through said protective overcoat including bond pad openings and an opening at said first electrode;
(d.) depositing a capacitor dielectric over exposed portions of said first electrode; and
(e.) forming a second electrode of said capacitor overlying said first electrode, said second electrode at least partially overlying said protective overcoat.
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Specification