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Copper metallurgy in integrated circuits

  • US 6,284,656 B1
  • Filed: 08/04/1998
  • Issued: 09/04/2001
  • Est. Priority Date: 08/04/1998
  • Status: Expired due to Term
First Claim
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1. A method of making copper-polymer-based interconnections in an integrated circuit, the method comprising:

  • applying a non-acidic polymeric precursor to a surface in the integrated-circuit assembly;

    curing the applied non-acidic polymeric precursor in a non-oxidizing atmosphere to form a polymeric layer;

    forming a first copper-adhesion layer on the polymeric layer;

    forming at least one copper structure on the first copper-adhesion layer; and

    forming a second copper-adhesion layer on the one copper structure.

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