Application-specific optoelectronic integrated circuit

• US 6,285,043 B1
• Filed: 11/01/1999
• Issued: 09/04/2001
• Est. Priority Date: 11/01/1999
• Status: Expired due to Fees

• Current Assignee: Curators of the University of Missouri (University of Missouri)
• Original Assignee: The Boeing Co.
• Inventors: Yap, Daniel
• Primary Examiner(s): Flynn, Nathan
• Assistant Examiner(s): Fordé , Remmon R.
• Application Number:
  US09/430,851
• Time in Patent Office: 673 Days
• Field of Search: 257/81, 257/99, 257/98, 257/432, 257/433, 257/459, 257/528
• US Class Current: 257/81
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: H01L 27/1446 in a repetitive configuration

Abstract

An application-specific rf optoelectronic integrated circuit having a generic chip member and a defining substrate in communication with at least one generic chip member. The generic chip member contains passive building block components that are independent from each other and being connected by paths external to the generic chip member. The external connection paths are defined by a defining substrate member having passive components for providing optical and electrical interconnection between selected building block components on the generic chip member to define the specific function of the integrated circuit. It is possible to use the same design of the generic chip for several applications merely by altering the interconnect paths on a defining substrate.

Claims

1. An integrated circuit comprising:

at least one chip member having a predefined pattern of building block components arranged thereon, said building block components being separate and independent from each other, said building block components having external connection points; and

a substrate member in communication with predetermined external connection points of said at least one chip member, said substrate member having a predefined pattern of circuit sections for modifying and selectively connecting selected building block components in said predefined pattern of building block components to each other thereby defining an application-specific integrated circuit.

2. The integrated circuit of claim 1 wherein said circuit sections further comprise passive components.

3. The integrated circuit of claim 2 wherein said passive components are chosen from the group consisting of transmission lines, capacitors, inductors, resistors, resonators, tuning stubs and rf filters, waveguides, reflectors, and means for holding optical fibers.

4. The integrated circuit of claim 3 wherein said means for holding optical fibers further comprises at least one groove for retaining an optical fiber.

5. The integrated circuit of claim 1 wherein said building blocks are active devices.

6. The integrated circuit of claim 5 wherein said active devices are optical devices and electronic devices.

7. The integrated circuit of claim 5 wherein said active devices are chosen from the group consisting of photodetectors, optoelectronic modulators, light emitters amplifier stages, buffers, drivers, switches, logic gates and latches.

8. The integrated circuit of claim 1 wherein said external connection points are solder-bump compatible pads.

9. The integrated circuit of claim 8 wherein a solder bump is disposed between said solder pads thereby defining a connecting path between said building blocks on said chip member and between said substrate member and said chip member.

10. The integrated circuit of claim 9 wherein said solder bump is formed as part of said substrate member.