×

Semiconductor device, method of fabricating the same and structure for mounting the same

  • US 6,285,085 B1
  • Filed: 07/28/1999
  • Issued: 09/04/2001
  • Est. Priority Date: 08/13/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor device comprising:

  • a semiconductor chip having a stepped side wall on a side surface;

    electrode pads formed on an upper surface of said semiconductor chip;

    an insulating film covering the upper surface and the stepped side wall of said semiconductor chip leaving surfaces of the electrode pads not covered;

    lower electrodes provided to extend over both said electrode pads and the stepped side wall of said semiconductor chip; and

    bumps provided on said lower electrodes.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×