Parasitic element for a substrate antenna

• US 6,285,327 B1
• Filed: 04/21/1998
• Issued: 09/04/2001
• Est. Priority Date: 04/21/1998
• Status: Expired due to Term

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: See, Puay Hoe
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US09/063,814
• Time in Patent Office: 1,232 Days
• Field of Search: H01/Q.124, H01/Q.136, 343/700.MS, 343/702, 343/729, 343/833, 343/834, 343/841, 343/846, 343/829
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/52 Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure absorbing means H01Q17/00
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H01Q 1/528 reducing the re-radiation of a support structure in a parabolic reflector antenna H01Q19/023
• CPC Class Codes: H01Q 5/378 Combination of fed elements with parasitic elements
• CPC Class Codes: H01Q 9/40 Element having extended radiating surface
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
• CPC Class Codes: H04B 1/3833 Hand-held transceivers

Abstract

A parasitic element for use with an internal antenna in a wireless device. Generally, the antenna is a substrate antenna with one or more conductive traces supported on a substrate and mounted offset from a ground plane associated with the wireless device. One or more signal or power transfer conductors, cables, or signal feeds are positioned immediately adjacent to the antenna, which are capable of coupling signals into the antenna which picks-up energy from fields around or emanating from the conductors. Alternatively, the conductors intercept a portion of the energy being transferred into the antenna. The parasitic patch element employs a thin conductive structure which is placed adjacent to, over or under those conductors, reduces a substantial portion of energy from coupling between the conductors and antenna by altering the resonant or energy coupling characteristics of the conductors. The parasitic element inhibits transfer of energy between the conductors and the antenna, which increases overall device gain. In addition, the parasitic element and the parasitic coupling of the parasitic element to the ground plane, increases the gain and bandwidth of the wireless devices. The parasitic element can be manufactured from a variety of materials and in a variety of shapes and be installed using a variety of known techniques for positioning and installing thin conductive or metallic layers of material.

Claims

1. A parasitic element for use with an internal substrate antenna in a wireless communication device having one or more signal or power transfer conductors or signal feeds located adjacent to said antenna, wherein said substrate antenna comprises:

one or more conductive traces supported on a dielectric substrate having a predetermined thickness;

said supporting substrate is mounted offset from and generally perpendicular to a ground plane associated with the wireless device; and

said parasitic element comprises;

at least one layer of conductive material disposed adjacent to one or more of said conductors in a region adjacent to said antenna, having a pre-selected width relative to said conductors, and a pre-selected length along said conductors sufficient to prevent energy from being coupled between said antenna and conductors in the region of said layer.

2. The parasitic element of claim 1 wherein said layer of conductive material is positioned either over or under one or more of said conductors.

3. The parasitic element of claim 1 wherein said one or more conductors extend between preselected signal processing elements of the wireless device and power sources and have a portion located immediately adjacent to said substrate antenna.

4. The parasitic element of claim 1 comprising at least two layers of conductive material.

5. The parasitic element of claim 1 wherein said preselected width is least twice as wide as said conductors.

6. The parasitic element of claim 1 wherein said at least one layer of conductive material comprises a patch of thin electrically conductive material placed over the conductors adjacent to the substrate antenna.

7. The parasitic element of claim 6 wherein said patch is parasitically coupled to a ground plane of said wireless device.

8. The parasitic element of claim 6 wherein said patch has a substantially rectangular shape.

9. The parasitic element of claim 6 wherein said patch has a substantially circular shape.

10. The parasitic element of claim 6 wherein said patch has a substantially triangular shape.

11. The parasitic element of claim 6 wherein said patch has a complex geometric shape.

12. The parasitic element of claim 1 wherein said conductive material is configured in size to reduce a substantial portion of energy from coupling between said conductors and substrate antenna by altering the resonant or energy coupling characteristics of the conductors.

13. The parasitic element of claim 1 wherein said conductive material is configured in size to increase the effective area and corresponding gain and bandwidth of said substrate antenna by preselected amounts.