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Multi-chip semiconductor chip module

  • US 6,287,949 B1
  • Filed: 09/01/1998
  • Issued: 09/11/2001
  • Est. Priority Date: 06/20/1994
  • Status: Expired due to Term
First Claim
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1. A method for fabricating a semiconductor device, said semiconductor device including a plurality of chip units each including a semi conductor chip and a base member carrying thereon said plurality of chip units, comprising the steps of:

  • disposing said plurality of chip units on said base member such that the chip units that are disposed adjacent each other abut with each other at respective side edges in a flush manner with no spaces between said chip units, thereby establishing interconnection of terminals provided on a chip unit with corresponding terminals provided on an adjacent chip unit, said plurality of chip units forming thereby a multi-chip assembly; and

    providing an interconnection with a terminal on said multi-chip assembly and a corresponding interconnection pad provided on said base member.

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