Contact module, as for a smart card, and method for making same

• US 6,288,905 B1
• Filed: 10/04/1999
• Issued: 09/11/2001
• Est. Priority Date: 04/15/1999
• Status: Expired due to Fees

• Current Assignee: Avante International Technology
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Gandhi, Jayprakash N.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/412,052
• Time in Patent Office: 708 Days
• Field of Search: 361/737, 361/782, 361/783, 361/792, 361/795, 361/748, 361/750, 361/751, 361/760, 361/767, 361/768, 361/771, 235/488, 235/492, 174/255, 174/258, 174/259, 174/262, 174/264, 174/256, 174/260, 174/257, 257/679, 257/668, 257/778, 257/787, 340/572.8, 298/30--32, 298/41, 298/52, 298/55, 438/118, 438/119, 438/108, 438/126, 438/127, 438/125
• US Class Current: 361/771
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: B32B 37/203 One or more of the layers being plastic
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 : connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 : Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 : Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 : with variable reactance for tuning the antenna
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/423 : characterised by electroplating method
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a second surface and electrically-conductive vias built up on the first surface of the metal contacts. A layer of dielectric adhesive on the first surface of the pattern of metal contacts surrounds the electrically-conductive vias except the ends thereof distal from the metal contacts. An electronic device has electrical contacts connected to the exposed ends of the conductive vias, as by wire bonds or by flip-chip type connections. The module is preferably made by forming a pattern of conductive vias on the first surface of a sheet of electrical contact material, the pattern of vias corresponding to the pattern of contacts of an electronic device; applying dielectric adhesive on the first surface of the sheet of electrical material except in locations corresponding to the vias; patterning the sheet of electrical material to define a pattern of electrical contacts thereon, wherein ones of the electrical contacts are associated with at least corresponding ones of the vias; and attaching the electronic device with the contacts of the electronic device electrically connected to corresponding vias.

Claims

1. A module having exposed contacts comprising:

a pattern of sheet metal contacts having a first surface and an exposed second surface;

a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of sheet metal contacts and having at least two holes therethrough to the first surface of said sheet metal contacts;

at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the first surface of the sheet metal contacts, each conductive via having an end distal from the first surface of said sheet metal contacts; and

at least one electronic device having electrical contacts connected to the distal end of said conductive vias.

2. The module of claim 1 wherein said conductive vias comprise metal deposited onto said metal contacts.

3. The module of claim 2 wherein said conductive vias and said metal contacts are formed of the same metal.

4. The module of claim 3 wherein said metal is selected from the group consisting of copper, aluminum, nickel, kovar, alloy 42, beryllium copper, brass, copper-based alloys, iron-based alloys, and combinations and alloys thereof, and laminates thereof.

5. The module of claim 4 further comprising a metal coating on the second surface of said metal contacts and on the distal end of said conductive vias, wherein said metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

6. The module of claim 2 wherein said metal of said conductive vias is plated metal deposited by one of chemical plating, immersion coating, electrolytic plating, and electroless plating.

7. The module of claim 1 wherein said conductive vias comprise electrically-conductive adhesive deposited onto said metal contacts.

8. The module of claim 7 wherein said electrically-conductive adhesive is a flexible adhesive.

9. The module of claim 1 wherein said conductive vias are formed in said holes in said layer of dielectric adhesive.

10. The module of claim 1 wherein the contacts of said electronic device are connected to said conductive vias by a connection selected from the group consisting of electrically-conductive adhesive, solder and wire bonding.

11. The module of claim 1 wherein said electronic device is attached to said dielectric adhesive layer by an insulating adhesive underfill.

12. The module of claim 1 wherein said electronic device is encapsulated on said dielectric adhesive layer by a high melt flow adhesive.

13. The module of claim 1 wherein said electronic device is attached to said dielectric adhesive layer by an insulating adhesive underfill and is encapsulated on said dielectric adhesive layer by a high melt flow adhesive.

14. A contact module having exposed contacts and including at least one electronic device comprising:

a sheet metal layer having a first surface and an exposed second surface, said sheet metal layer having openings therethrough defining a pattern of at least two exposed sheet metal contacts;

a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said sheet metal layer, said dielectric adhesive layer having at least two holes therethrough each to the first surface of one of said at least two sheet metal contacts, respectively;

at least two electrically-conductive vias substantially filling the at least two holes of said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the respective first surfaces of the at least two sheet metal contacts, each electrically-conductive via having an end distal from said sheet metal layer; and

means for connecting at least two contacts of the at least one electronic device each to a respective distal end of one of said electrically-conductive vias.

15. The contact module of claim 14 wherein said electrically-conductive vias comprise metal deposited onto said metal layer.

16. The contact module of claim 15 wherein said electrically-conductive vias and said metal layer are of the same metal selected from the group consisting of copper, aluminum, nickel, kovar, alloy 42, beryllium copper, brass, copper-based alloys, iron-based alloys, and combinations and alloys thereof, and laminates thereof.

17. The contact module of claim 15 wherein said deposited metal of said electrically-conductive vias is deposited by one of chemical plating, immersion coating, electrolytic plating, and electroless plating.

18. The contact module of claim 14 wherein said electrically-conductive vias comprise electrically-conductive adhesive deposited onto said metal layer.

19. The contact module of claim 14 further comprising a metal coating on the second surface of said metal contacts and on the distal end of said electrically-conductive vias, said metal coating including at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

20. The contact module of claim 14 wherein said electrically-conductive vias are formed in the holes in said layer of dielectric adhesive by depositing electrically-conductive adhesive therein.

21. The contact module of claim 14 wherein said electrically-conductive vias are formed in the holes in said layer of dielectric adhesive by depositing metal onto the first surface of said metal contacts therein.

22. The contact module of claim 14 wherein said means for connecting includes connections selected from the group consisting of electrically-conductive adhesive, solder and wire bonding.

23. The contact module of claim 14 further comprising an insulating adhesive underfill attaching said at least one electronic device to said dielectric adhesive layer.

24. The contact module of claim 14 further comprising a high melt flow adhesive encapsulating said electronic device on said dielectric adhesive layer.

25. The contact module of claim 14 further comprising an insulating adhesive underfill attaching said electronic device to said dielectric adhesive layer and a high melt flow adhesive encapsulating said electronic device on said dielectric adhesive layer.

26. A module comprising:

a pattern of metal foil contacts having a first surface and an exposed second surface;

a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts;

a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes;

at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and

at least one electronic device having electrical contacts connected to the distal end of said conductive vias.

27. The module of claim 26 wherein said oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

28. The module of claim 26 further comprising an oxidation resistant metal coating on the at least one of the second surface of said metal foil contacts and the distal end of said conductive vias, wherein said oxidation resistant metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

29. A module comprising:

a pattern of metal foil contacts having a first surface and an exposed second surface;

a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts;

a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes;

at least two vias of electrically-conductive adhesive substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and

at least one electronic device having electrical contacts connected to the distal end of said conductive vias.

30. The module of claim 29 wherein said electrically-conductive adhesive is a flexible electrically-conductive adhesive.

31. The module of claim 29 wherein said oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

32. The module of claim 29 further comprising an oxidation resistant metal coating on the at least one of the second surface of said metal foil contacts and the distal end of said conductive vias, wherein said oxidation resistant metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

33. A method for making a module including an electronic device comprising:

providing a sheet of electrical contact material having first and second surfaces;

providing an electronic device having a pattern of contacts thereon;

applying a layer of at least one of a thermoplastic and a thermosetting dielectric adhesive on the first surface of the sheet of electrical contact material except in locations corresponding to locations of electrically-conductive vias, whereby the layer of dielectric adhesive has blind holes to the sheet of electrical contact material in locations corresponding to the locations of electrically conductive vias;

one of B-staging and curing the layer of dielectric adhesive;

forming a pattern of electrically-conductive vias on the first surface of the sheet of electrical contact material in the blind holes of the layer of dielectric adhesive, the pattern of electrically-conductive vias corresponding to the pattern of contacts of the electronic device;

patterning the sheet of electrical contact material to define a pattern of exposed electrical contacts thereon after said one of B-staging and curing the layer of dielectric adhesive, wherein ones of the exposed electrical contacts are associated with at least corresponding ones of the electrically-conductive vias; and

attaching the electronic device with the contacts of the electronic device electrically connected to corresponding ones of the electrically-conductive vias.

34. The method of claim 33 further comprising encapsulating the electronic device to the layer of dielectric adhesive.

35. The method of claim 34 wherein said encapsulating includes applying a high melt flow adhesive by one of roll coating, screen printing, stenciling and laminating.

36. The method of claim 33 wherein said forming a pattern of electrically-conductive vias precedes said applying a layer of dielectric adhesive.

37. The method of claim 33 wherein said applying a layer of dielectric adhesive precedes said forming a pattern of electrically-conductive vias.

38. The method of claim 33 wherein said forming a pattern of electrically-conductive vias precedes said patterning the sheet of electrical contact material.

39. The method of claim 33 wherein said patterning the sheet of electrical contact material precedes said forming a pattern of electrically-conductive vias.

40. The method of claim 33 wherein said forming a pattern of electrically-conductive vias includes building up metal vias on the first surface of the sheet of electrical contact material.

41. The method of claim 40 wherein said building up includes one of chemical plating, immersion coating, electrolytic plating, and electroless plating.

42. The method of claim 33 wherein said forming a pattern of electrically-conductive vias includes depositing electrically-conductive adhesive vias on the first surface of the sheet of electrical contact material.

43. The method of claim 42 wherein said depositing includes one of roll coating, screen printing, stenciling, mask printing, ink-jet printing and laminating.

44. The method of claim 33 wherein said applying a layer of dielectric adhesive includes applying an electrically-insulating adhesive by one of roll coating, screen printing, stenciling and laminating.

45. The method of claim 33 wherein said patterning the sheet of electrical contact material includes patterning a photoresist on the sheet of electrical contact material and etching the sheet of electrical contact material.

46. The method of claim 33 further comprising coating at least one of the pattern of electrical contacts and the electrically-conductive vias with a metal including at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.

47. The method of claim 33 wherein said attaching the electronic device includes applying an electrically-conductive adhesive to the electrically-conductive vias or to the contacts of the electronic device, and positioning the electronic device such that corresponding ones of the electrically-conductive vias and contacts of the electronic device are joined together by the electrically-conductive adhesive.

48. The method of claim 33 further comprising, prior to said forming a pattern of electrically-conductive vias, coating at least the locations corresponding to the locations of electrically-conductive vias on the first surface of the sheet of electrical contact material with an oxidation resistant metal.

49. The method of claim 48 wherein the oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.