Vibration absorber using shape memory material

• US 6,290,037 B1
• Filed: 04/21/1999
• Issued: 09/18/2001
• Est. Priority Date: 04/21/1999
• Status: Expired due to Fees

• Current Assignee: Purdue Research Foundation (Purdue University)
• Original Assignee: Purdue Research Foundation (Purdue University)
• Inventors: Williams, Keith A., Bernhard, Robert J., Chiu, George Tsu-Chih
• Primary Examiner(s): Schwartz, Christopher P.
• Application Number:
  US09/295,717
• Time in Patent Office: 881 Days
• Field of Search: 188/379, 188/378, 188/322.5, 73/514.36, 73/514.38, 73/570, 73/579, 364/508, 701/124
• US Class Current: 188/379
• CPC Class Codes: F16F 2222/02 temperature-related F16F2228/002 takes precedence
• CPC Class Codes: F16F 2224/0258 Shape-memory metals, e.g. Ni-Ti alloys
• CPC Class Codes: F16F 7/1005 characterised by active control of the mass
• CPC Class Codes: F16F 7/116 on metal springs

Abstract

The present invention relates to a vibration absorber in which an absorber end mass is coupled to a primary mass by means of a cantilevered beam, wherein at least a portion of the beam comprises a shape memory alloy (SMA). Preferably, the end mass is coupled to the primary mass with several discrete SMA wires which may be individually heated. When each of the SMA wires is heated above a predetermined temperature, the SMA material undergoes a phase change which results in a change in the stiffness of the SMA wire. Heating of the various wires in various combinations allows the operational frequency of the absorber to be actively tuned. The frequency of the absorber may therefore be tuned to closely match the current vibrational frequency of the primary mass, thereby allowing the absorber to be adaptively tuned to the frequency of the primary mass in a simple and straightforward manner.

Claims

1. A vibration absorber coupled to a primary mass for absorbing a vibration of the primary mass, the vibration absorber comprising:

a tuning mass;

at least one shape memory element coupled between the primary mass and the tuning mass; and

at least one non-shape memory element coupled between the primary mass and the tuning mass;

wherein a frequency band of vibration absorbed from the primary mass by the vibration absorber may be tuned by heating the shape memory element.

2. The vibration absorber of claim 1, wherein the at least one shape memory element comprises a shape memory alloy wire.

3. The vibration absorber of claim 1, wherein the at least one shape memory element comprises a pair of shape memory alloy wires.

4. The vibration absorber of claim 3, wherein the pair of shape memory alloy wires are electrically conductively coupled adjacent the tuning mass.

5. The vibration absorber of claim 4, wherein the pair of shape memory alloy wires are heated by passing an electrical current through them.

6. The vibration absorber of claim 1, wherein the shape memory element comprises Nitinol.

7. The vibration absorber of claim 1, wherein the at least one non-shape memory element comprises a pair of steel wires.

8. The vibration absorber of claim 1, further comprising:

a sensor operative to sense a frequency of vibration of the primary mass;

a heater operative to heat the at least one shape memory element; and

a processor coupled to the sensor and the heater and operative to heat the at least one shape memory element in response to an output received from the sensor.

9. The vibration absorber of claim 8, wherein the sensor comprises an accelerometer.

10. The vibration absorber of claim 8, wherein the heater comprises a current source.

11. A vibration absorber coupled to a primary mass for absorbing a vibration of the primary mass, the vibration absorber comprising:

a tuning mass;

a first shape memory element coupled between the primary mass and the tuning mass;

a second shape memory element coupled between the primary mass and the tuning mass;

at least one non-shape memory element coupled between the primary mass and the tuning mass; and

wherein a frequency band of vibration absorbed from the primary mass by the vibration absorber may be tuned by heating only the first element, only the second element, or both the first and second elements.

12. The vibration absorber of claim 11, wherein the first and second shape memory elements comprise a first and second shape memory alloy wire, respectively.

13. The vibration absorber of claim 11, wherein the first and second shape memory elements comprise a first and second pair of shape memory alloy wires, respectively.

14. The vibration absorber of claim 13, wherein:

the first pair of shape memory alloy wires are electrically conductively coupled adjacent the tuning mass; and

the second pair of shape memory alloy wires are electrically conductively coupled adjacent the tuning mass.

15. The vibration absorber of claim 14, wherein:

the first pair of shape memory alloy wires are heated by passing a first current through them; and

the second pair of shape memory alloy wires are heated by passing a second current through them.

16. The vibration absorber of claim 15, wherein the first and second currents are substantially equal.

17. The vibration absorber of claim 11, wherein the first and second shape memory elements comprise Nitinol.

18. The vibration absorber of claim 11, wherein the at least one non-shape memory element comprises a pair of steel wires.

19. The vibration absorber of claim 11, wherein the first and second shape memory elements have differing elastic moduli when in the same state.

20. The vibration absorber of claim 19, wherein the first and second shape memory elements comprise a first and second shape memory alloy wire, respectively, having different diameters.

21. The vibration absorber of claim 19, wherein the first and second shape memory elements comprise a first and second shape memory alloy cantilevered beam, respectively.

22. The vibration absorber of claim 19, wherein the first and second shape memory elements comprise a first and second pair of shape memory alloy wires.

23. The vibration absorber of claim 19, wherein:

the first shape memory element is heated by passing a first current through it; and

the second shape memory element is heated by passing a second current through it.

24. The vibration absorber of claim 19, wherein the first and second shape memory elements comprise Nitinol.

25. The vibration absorber of claim 19, further comprising at least a third shape memory element, the shape memory elements having elastic moduli of their respective states in a relationship to each other such that a total effective elastic modulus of the shape memory elements can be increased by increments by toggling the states of the shape memory elements according to a pattern of binary counting.

26. The vibration absorber of claim 19, wherein the shape memory elements having elastic moduli of their respective states in a relationship to each other and to that of the at least one non-shape memory element such that a total effective elastic modulus of the shape memory elements can be increased by increments by toggling the states of the shape memory elements according to a pattern of binary counting.

27. A method for controlling a vibration absorber incorporating a shape memory element therein, comprising the steps of:

a) sensing a vibration of the absorber;

b) heating the shape memory element to a first temperature in order to stiffen the vibration absorber relatively quickly;

c) determining when the vibration of the absorber has been attenuated by at least a predetermined amount; and

d) reducing the heating of the shape memory element to a second temperature;

e) wherein the first temperature is greater than the second temperature; and

f) wherein the second temperature is great enough to cause the shape memory element to continue to exhibit a shape memory effect.

28. The method of claim 27, wherein the heating of steps (b) and (d) comprises resistive heating caused by flowing a current through the shape memory element.

29. The method of claim 28, wherein a first current level is applied to achieve the first temperature and a second current level is applied to achieve the second temperature, wherein the first current is greater than the second current.

30. A method for absorbing vibrations in a primary mass, comprising:

providing a vibration absorber coupled to the primary mass, and comprising a first and a second shape memory element having differing elastic moduli, and at least one non-shape memory element;

detecting a frequency of vibrations of the primary mass;

selecting the state for each of the first and second shape memory elements which will cause the vibration absorber to maximally dampen the vibrations of the primary mass;

adjusting a temperature of the first and second shape memory elements so as to cause the first and second shape memory elements to adopt the selected states.