×

Method and device for controlled cleaving process

  • US 6,291,313 B1
  • Filed: 05/18/1999
  • Issued: 09/18/2001
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A process for forming a film of material from substrates, said process comprising:

  • forming a stressed region at a selected depth underneath a surface of a substrate, said stressed region at said selected depth to define a substrate material to be removed above said selected depth; and

    providing energy using a fluid to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×