Polyamide resin compositions with excellent weld strength

• US 6,291,633 B1
• Filed: 01/07/2000
• Issued: 09/18/2001
• Est. Priority Date: 01/08/1999
• Status: Expired due to Term

• Current Assignee: UBE Industries Limited
• Original Assignee: UBE Industries Limited
• Inventors: Nakamura, Ken
• Primary Examiner(s): HAMPTON HIGHTOWER, PATRICIA
• Application Number:
  US09/479,684
• Time in Patent Office: 620 Days
• Field of Search: 528/339, 528/310, 528/322, 528/170, 528/332, 528/606, 528/397, 528/447, 528/449, 528/451, 528/464, 528/496, 528/933.2
• US Class Current: 528/310
• CPC Class Codes: C08L 77/00 Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 77/06 Polyamides derived from polyamines and polycarboxylic acids C08L77/10 takes precedence

Abstract

A molding polyamide resin composition with excellent weld strength is disclosed which comprises: 100 parts by weight of a polyamide resin comprising from 95 to 55 wt % crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and/or crystalline aliphatic polyamide resin and from 5 to 45 wt % polyamide resin comprising units derived from a xylylenediamine and units derived from an aliphatic dicarboxylic acid or noncrystalline, partly aromatic copolyamide resin containing at least two kinds of aromatic monomer units; and from 5 to 200 parts by weight of an inorganic filler.

Claims

1. A molding polyamide resin composition which comprises 100 parts by weight of a polyamide resin comprisingto 55 wt % of at least one resin selected from the group consisting of (A-1) a crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and (A-2) a crystalline aliphatic polyamide resin;

and

5 to 45 wt % of (B-1) a polyamide resin comprising units derived from a xylylenediamine and units derived from an aliphatic dicarboxylic acid; and

from 5 to 200 parts by weight of (C) an inorganic filler.

2. The molding polyamide resin composition of claim 1, wherein ingredient (A-1) comprises a crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and having a melting point of from 260°

C. up to 320°

C.

3. The molding polyamide resin composition of claim 1, wherein ingredient (A-1) is crystalline, partly aromatic copolyamide formed from an equimolar salt of hexamethylenediamine with adipic acid in the amount of 30-70 wt %, an equimolar salt of hexamethylenediamine with terephthalic acid in the amount of 70-30 wt %, and at least one monomer forming an aliphatic polyamide in the amount of 0-15 wt %.

4. The molding polyamide resin composition of claim 3, wherein the monomer forming an aliphatic polyamide is at least one member selected from the group consisting of 6-aminocaproic acid, ε

-caprolactam, 11-aminoundecanoic acid, 12-aminododecanoic acid, and laurolactam.

5. The molding polyamide resin composition of claim 1, wherein ingredient (A-2) is a crystalline aliphatic polyamide resin formed from an aliphatic diamine and an aliphatic dicarboxylic acid or from a lactam.

6. The molding polyamide resin composition of claim 1, wherein the inorganic filler (C) is glass fibers.

7. A molding polyamide resin composition which comprises 100 parts by weight of a polyamide resin comprisingto 55 wt % of at least one resin selected from the group consisting of (A-1) a crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and (A-2) a crystalline aliphatic polyamide resin;

and

5 to 45 wt % of (B-2) a noncrystalline, partly aromatic copolyamide resin containing at least two kinds of aromatic monomer units; and

from 5 to 200 parts by weight of (C) an inorganic filler.

8. The molding polyamide resin composition of claim 7, wherein the polyamide resin comprises (A-1) a crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and having a melting point of from 260°

C. to up to 320°

C., and

(B-2) a noncrystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer unit and having a melting point of 300°

C. or higher.

9. The molding polyamide resin composition of claim 7 wherein ingredient (A-1) is a crystalline, partly aromatic copolyamide formed from an equimolar salt of hexamethylenediamine with adipic acid in the amount of 30-70 wt %, an equimolar salt of hexamethylenediamine with terephthalic acid in the amount of 70-30 wt %, and at least one monomer forming an aliphatic polyamide in the amount of 0-15 wt %.

10. The molding polyamide resin composition of claim 9, wherein the monomer forming an aliphatic polyamide is at least one member selected from the group consisting of 6-aminocaproic acid, ε

-caprolactam, 11-aminoundecanoic acid, 12-aminododecanoic acid, and laurolactam.

11. The molding polyamide resin composition of claim 7, wherein ingredient (A-2) is a crystalline aliphatic polyamide resin formed from an aliphatic diamine and an aliphatic dicarboxylic acid or from a lactam.

12. The molding polyamide resin composition of claim 7, wherein ingredient (B-2) is a noncrystalline, partly aromatic copolyamide formed from an equimolar salt of hexamethylenediamine with isophthalic acid in the amount of 90-60 wt %, and an equimolar salt of hexamethylenediamine with terephthalic acid in the amount of 10-40 wt %.

13. The molding polyamide resin composition of claim 7, wherein the inorganic filler (C) is glass fibers.