Package for multiple high power electrical components

• US 6,291,878 B1
• Filed: 04/22/1993
• Issued: 09/18/2001
• Est. Priority Date: 04/22/1993
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Pershall, Arthur A., Anderson, W. Kyle, Jackson, Stephen E.
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/052,015
• Time in Patent Office: 3,071 Days
• Field of Search: 257/674, 257/691, 257/723, 257/725, 257/728, 257/724, 257/909, 257/925, 174/15.1, 174/99.R, 174/69, 174/701, 174/707, 174/15.199 R, 361/64, 361/701, 361/707
• US Class Current: 257/691
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]

Abstract

A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.

Claims

1. A semiconductor package, comprising:

an electrically conductive package support member having a central aperture therethrough;

a central electrode structure extending through the central aperture of the package support member and electrically isolated therefrom;

a plurality of semiconductor devices disposed on the package support member in an array surrounding the central electrode structure, each semiconductor device including first and second electrodes wherein the first electrodes of the semiconductor devices are electrically interconnected by their support member;

a first terminal electrically connected to the package support member;

wherein the central electrode structure includes a bus for electrically interconnecting the second electrodes of the semiconductor devices and a second terminal is coupled to the bus, each semiconductor device is disposed on an associated device support structure having a base plate electrically interconnecting the first electrode of the semiconductor device to the package support member and means for electrically coupling the second electrode of the semiconductor device to the bus of the central electrode structure; and

wherein the coupling means comprises a strip of conductive material disposed on corrugated fin stock.

2. A semiconductor package, comprising:

an electrically conductive package support member having a central aperture therethrough;

a central electrode structure extending through the central aperture of the package support member and electrically isolated therefrom;

a plurality of semiconductor devices disposed on the package support member in an array surrounding the central electrode structure, each semiconductor device including first and second electrodes wherein the first electrodes of the semiconductor devices are electrically interconnected by their support member;

a first terminal electrically connected to the package support member;

wherein the central electrode structure includes a bus for electrically interconnecting the second electrodes of the semiconductor devices and a second terminal is coupled to the bus, each semiconductor device is disposed on an associated device support structure having a base plate electrically interconnecting the first electrode of the semiconductor device to the package support member and means for electrically coupling the second electrode of the semiconductor device to the bus of the central electrode structure; and

further including a cover disposed over the semiconductor devices wherein the cover is in electrical contact with the first electrode of the semiconductor devices.

3. A semiconductor package, comprising:

an electrically conductive package support member having a central aperture therethrough;

a central electrode structure extending through the central aperture of the package support member and electrically isolated therefrom;

a plurality of semiconductor devices disposed on the package support member in an array surrounding the central electrode structure, each semiconductor device including first and second electrodes wherein the first electrodes of the semiconductor devices are electrically interconnected by their support member;

a first terminal electrically connected to the package support member;

wherein the central electrode structure includes a bus for electrically interconnecting the second electrodes of the semiconductor devices and a second terminal is coupled to the bus, each semiconductor device is disposed on an associated device support structure having a base plate electrically interconnecting the first electrode of the semiconductor device to the package support member and means for electrically coupling the second electrode of the semiconductor device to the bus of the central electrode structure; and

further including a cover disposed over the semiconductor devices and means for electrically isolating the cover from the first electrodes of the semiconductor devices.