Functionally symmetric integrated circuit die
First Claim
1. An integrated circuit device, comprising:
- a substrate; and
a plurality of functionally symmetric interface pads coupling integrated circuitry of an integrated circuit device to a receptor site of an electronic device, the receptor site having a three dimensional physical shape having a depth, the integrated circuit die having the three dimensional physical shape to be received within the receptor site, the plurality of interface pads arranged in the substrate such that the electronic device operates with the integrated circuit die mounted to the receptor site in any one of a plurality of orientations relative to the receptor site.
5 Assignments
0 Petitions
Accused Products
Abstract
A functionally symmetric integrated circuit die to be mounted into a mutually symmetric receptor site. In one embodiment, a functionally symmetric integrated circuit die includes a substrate and a plurality of interface pads arranged thereon. The plurality of interface pads couple integrated circuitry disposed in the substrate to a plurality of interface pads of a mutually symmetric receptor site of an electronic device. The integrated circuit die can be mounted into the receptor site in any of a plurality of rotational orientations relative to the receptor site. The plurality of interface pads on the integrated circuit die and the receptor site are arranged such that an electronic device functions with the integrated circuit die in mounted in the receptor site in any one of the plurality of orientations.
264 Citations
80 Claims
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1. An integrated circuit device, comprising:
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a substrate; and
a plurality of functionally symmetric interface pads coupling integrated circuitry of an integrated circuit device to a receptor site of an electronic device, the receptor site having a three dimensional physical shape having a depth, the integrated circuit die having the three dimensional physical shape to be received within the receptor site, the plurality of interface pads arranged in the substrate such that the electronic device operates with the integrated circuit die mounted to the receptor site in any one of a plurality of orientations relative to the receptor site. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 27, 28)
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12. A method of operating an electronic device, the method comprising:
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providing an integrated circuit die having a plurality of interface pads physically arranged in a substrate of the integrated circuit die in functionally symmetric pattern to couple integrated circuitry of the integrated circuit die to a receptor site of the electronic device, the receptor site having a three dimensional physical shape having a depth, the integrated circuit die having the three dimensional physical shape to be received within the receptor site; and
mounting the integrated circuit die to the receptor site in any one of a plurality of orientations relative to the receptor site. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. An electronic device, comprising:
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a receptor site in a substrate of the electronic device, the receptor site including a plurality of receptor interface pads, the receptor site having a three dimensional physical shape having a depth;
an integrated circuit die having the three dimensional physical shape to be received within the receptor site, the integrated circuit die having a plurality of die interface pads to couple integrated circuitry of the integrated circuit die to the receptor site, the plurality of die interface pads and receptor interface pads arranged in a mutually functionally symmetric pattern such that the electronic device operates with the plurality of die interface pads engaged with the plurality of receptor interface pads in any one of a plurality of orientations relative to the receptor site. - View Dependent Claims (22, 23, 24, 25, 26)
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29. An integrated circuit die, comprising:
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a substrate; and
a plurality of functionally symmetric interface pads coupling integrated circuitry of an integrated circuit die to a receptor site of an electronic device, the plurality of interface pads having a rotationally symmetric arrangement in the substrate such that the electronic device operates with the integrated circuit die mounted to the receptor site in any one of a plurality of N rotational orientations relative to the receptor site, wherein an internal layout of the integrated circuit die is not functionally symmetric over the plurality of N rotational orientations. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of operating an electronic device, the method comprising:
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providing an integrated circuit die having a plurality of interface pads physically arranged in a substrate of the integrated circuit die in functionally symmetric pattern over a plurality of N rotational orientations to couple integrated circuitry of the integrated circuit die to a receptor site of the electronic device, wherein an internal layout of the integrated circuit die is not functionally symmetric over the plurality of N rotational orientations; and
mounting the integrated circuit die to the receptor site in any one of a plurality of N rotational orientations relative to the receptor site. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48)
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49. An electronic device, comprising:
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a receptor site in a substrate of the electronic device, the receptor site including a plurality of receptor interface pads;
an integrated circuit die having a plurality of die interface pads to couple integrated circuitry of the integrated circuit die to the receptor site, the plurality of die interface pads and receptor interface pads arranged in a mutually functionally symmetric pattern over a plurality of N rotational orientations such that the electronic device operates with the plurality of die interface pads engaged with the plurality of receptor interface pads in any one of the plurality of N rotational orientations, wherein an internal layout of the integrated circuit die is not functionally symmetric over the plurality of N rotational orientations. - View Dependent Claims (50, 51, 52, 53, 54)
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55. An integrated circuit device, comprising:
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a substrate; and
a plurality of functionally symmetric interface pads coupling integrated circuitry of an integrated circuit die to a receptor site of an electronic device, the plurality of interface pads arranged in the substrate such that the electronic device operates with the integrated circuit die self-aligned and mounted to the receptor site in any one of a plurality of orientations relative to the receptor site. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 69)
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66. A method of operating an electronic device, the method comprising the steps of:
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providing an integrated circuit die having a plurality of interface pads physically arranged in a substrate of the integrated circuit die in functionally symmetric pattern to couple integrated circuitry of the integrated circuit die to a receptor site of the electronic device;
self-aligning the integrated circuit die to the receptor site in any one of a plurality of orientations relative to the receptor site; and
mounting the integrated circuit die to the receptor site in said any one of the plurality of orientations relative to the receptor site. - View Dependent Claims (67, 68, 70, 71, 72, 73, 74)
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75. An electronic device, comprising:
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a receptor site in a substrate of the electronic device, the receptor site including a plurality of receptor interface pads;
an integrated circuit die having a plurality of die interface pads to couple integrated circuitry of the integrated circuit die to the receptor site, the plurality of die interface pads and receptor interface pads arranged in a mutually functionally symmetric pattern such that the electronic device operates with the plurality of die interface pads engaged with the plurality of receptor interface pads in any one of a plurality of orientations relative to the receptor site, the integrated circuit die self-aligned with the receptor site. - View Dependent Claims (76, 77, 78, 79, 80)
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Specification