Fine inductor having 3-dimensional coil structure and method for producing the same

• US 6,292,084 B1
• Filed: 08/20/1998
• Issued: 09/18/2001
• Est. Priority Date: 09/10/1997
• Status: Expired due to Term

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Lee, Yong Il, Baek, Jong Tae, Yoo, Hyung Joun, Choi, Chang Auck, Lee, Jong Hyun, Jang, Won Ick
• Primary Examiner(s): DONOVAN, LINCOLN D
• Assistant Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US09/136,613
• Time in Patent Office: 1,125 Days
• Field of Search: 336/223, 336/200, 336/225, 336/232, 336/83, 296/021, 296/032.3, 296/032.4, 296/032.5
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 5/003 Printed circuit coils

Abstract

A fine inductor having a 3-dimensional coil structure is disclosed. The inductor includes an insulating layer having a groove, a plurality of first conductive patterns wherein the respective first conductive patterns cover bottom and both walls of the groove formed in the insulating layer, both ends of the respective first conductive patterns are extended over upper surface of both sides of the groove, and each of the first conductive patterns is disposed at a predetermined space between adjacent first conductive patterns, and a plurality of second conductive patterns wherein one ends of the respective second conductive patterns are connected to the one ends of the first conductive patterns extended over upper surface and the other ends of the respective second conductive patterns are connected to the other ends of the adjacent first conductive patterns extended over upper surface, thereby forming a coil structure together with the first conductive patterns.

Claims

1. A fine inductor having a 3-dimensional coil structures comprising:

an insulating layer on a substrate having a groove;

a plurality of first conductive patterns wherein each of the first conductive patterns is formed in the groove of the insulation layer by a photo-masking process and a metal deposition process, each of the first conductive patterns covers a bottom surface and both walls of the groove, both ends of the respective first conductive patterns are extended over an upper surface of both sides of the groove, and each of the first conductive patterns is disposed at a predetermined space between adjacent first conductive patterns; and

a plurality of second conductive patterns wherein each of the second conductive patterns is formed on the insulation layer by the photo-masking process and the metal deposition process after the first conductive patterns are formed in the groove of the insulation layer, one end of the respective second conductive patterns are connected to one end of the first conductive patterns extended over an upper surface and the other end of the respective second conductive patterns are connected to the other end of the respective adjacent first conductive patterns extended over the upper surface, thereby forming a coil structure together with the first conductive patterns.

2. A fine inductor according to claim 1, further comprising a pair of connecting pads which are connected to both ends of the coil.

3. A fine inductor having a 3-dimensional coil structure, comprising:

a substrate having a groove formed therein;

a plurality of first conductive patterns, wherein each of the first conductive patterns is formed in the groove of the substrate by a photo-masking process and a metal deposition process, each of the first conductive patterns covers a bottom surface and both walls of the groove, both ends of the respective first conductive patterns are extended over an upper surface of both sides of the groove, and each of the first conductive patterns is disposed at a predetermined space between adjacent first conductive patterns; and

a plurality of second conductive patterns, wherein each of the second conductive patterns is formed on the substrate by the photo-masking process and the metal deposition process after the first conductive patterns are formed in the groove of the substrate, one end of the respective second conductive patterns are connected to one end of the first conductive patterns extended over an upper surface and the other end of the respective second conductive patterns are connected to the other end of the respective adjacent first conductive patterns extended over the upper surface, thereby forming a coil having a 3-dimensional structure.

4. A fine inductor according to claim 3, further comprising a pair of connecting pads which are connected to both ends of the coil having said 3-dimensional structure.

5. A fine inductor according to claim 4, wherein said first and second conductive patterns correspond to metal patterns forming the coil having said 3-dimensional structure.