Electronic part and a method of manufacturing the same

• US 6,292,139 B1
• Filed: 04/14/1999
• Issued: 09/18/2001
• Est. Priority Date: 04/15/1998
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Yamamoto, Keizo, Kushihi, Yuichi, Yamaki, Kazuhisa
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/291,848
• Time in Patent Office: 888 Days
• Field of Search: 343/700.MS, 343/895, 216/6, 216/13, 430/315, 430/324
• US Class Current: 343/700.0MS
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0236 Plating catalyst as filler in insulating material
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence

Abstract

The invention provides an electronic part comprising an electronic-part body comprising: composite-material body made of synthetic resin in which ceramic powder as a functional material and a catalytic agent to make plating practicable are dispersed; and a layer of composite material of synthetic resin in which ceramic powder as a functional material is dispersed, said layer covering the external surface of said composite-material body except the portion in which an electrode is to be disposed; and an electrode disposed on the external surface of said electronic-part body. The above described electronic part is excellent in the freedom of shape, high in dimensional accuracy, and it is easy to realize the intended electrical characteristics.

Claims

1. An electronic part comprising:

an electronic-part body comprising a first composite material which comprises synthetic resin having ceramic functional material and a catalytic agent to make plating practicable dispersed therein, said body having an external surface, and a layer of a second composite material comprising synthetic resin having ceramic functional material dispersed therein, said layer of second composite material covering the external surface of said first composite material body except that portion at which an electrode is disposed; and

at least one electrode disposed on the external surface of said electronic-part body.

2. The electronic part according to claim 1, wherein said ceramic functional material is selected from the group consisting of dielectric ceramic, magnetic ceramic and piezoelectric ceramic.

3. The electronic part according to claim 2, wherein the ceramic is about 70 vol. % or less of the synthetic resin in each of said composite materials.

4. The electronic part according to claim 3, wherein the ceramic is about 50 vol. % or less of the synthetic resin in each of said composite materials.

5. The electronic part according to claim 3, wherein said electronic part is a dielectric antenna and the ceramic is a dielectric ceramic.

6. The electronic part according to claim 5, wherein the dielectric constant of each of said composite materials is about 4 to 20.

7. The electronic part according to claim 3, wherein said electronic part comprises a coil and the ceramic is a magnetic ceramic.

8. The electronic part according to claim 7, wherein said synthetic resin is polyphenylene sulphide and the ceramic is a NiZn ferrite.

9. The electronic part according to claim 1, wherein said electronic part is a dielectric antenna and the ceramic is a dielectric ceramic.

10. The electronic part according to claim 1, wherein said electronic part comprises a coil and the ceramic is a magnetic ceramic.

11. The electronic part according to claim 1, wherein said ceramic is in powder or whisker form.

12. A method of manufacturing an electronic part comprising the steps of:

providing a molded product comprising synthetic resin having ceramic functional material and a catalytic agent to make plating practicable dispersed therein;

forming a layer of composite material comprising synthetic resin having ceramic functional material dispersed therein so as to cover a portion the external surface of the molded product except for the portion at which an electrode is to be formed to form a second product; and

plating a portion of the second product not covered by said layer, and forming an electrode thereon.

13. The method according to claim 12, wherein said ceramic functional material is selected from the group consisting of dielectric ceramic, magnetic ceramic and piezoelectric ceramic.

14. The method according to claim 13, wherein the ceramic is about 70 vol. % or less of the synthetic resin in each of said composite materials.

15. The method according to claim 14, wherein the ceramic is about 50 vol. % or less of the synthetic resin in each of said composite materials.

16. The method according to claim 12, wherein said second product is in the form of an electroless dielectric antenna, the ceramic is a dielectric ceramic and at least two electrodes are formed so as to complete formation of the dielectric antenna.

17. The electronic part according to claim 12, wherein said second product is in the form of an electroless coil, the ceramic is a magnetic ceramic and the electrode formation completes formation of an electronic coil.

18. The method according to claim 12, wherein said ceramic is in powder or whisker form.

19. The method according to claim 18, including the step of molding a product comprising synthetic resin having ceramic functional material and a catalytic agent to make plating practicable dispersed therein.