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Wafer inspection system for distinguishing pits and particles

DC
  • US 6,292,259 B1
  • Filed: 07/24/2000
  • Issued: 09/18/2001
  • Est. Priority Date: 03/06/1995
  • Status: Expired due to Term
First Claim
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1. A surface inspection system for distinguishing between particle defects and pit defects on a surface of a workpiece comprising:

  • an inspection station for receiving the workpiece;

    a scanner positioned to scan a surface of the workpiece at the inspection station, the scanner including a light source arranged to project p-polarized light at an angle of incidence oblique to the workpiece surface;

    a first collector positioned to collect light scattered from the surface of the workpiece at a central zone;

    a second collector positioned to collect light scattered from the surface of the workpiece at an oblique zone offset angularly from the central zone;

    one or more converters for converting the collected light components into respective signals representative of the light scattered into the central zone and oblique zone; and

    a system controller configured to receive the signals, compare the signals, and classify defects as pits or particles based at least in part on the comparison.

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