System and method of optically inspecting surface structures on an object
First Claim
1. A system for inspecting a surface of a semiconductor wafer having a straight side (flat), said system comprising:
- a support for supporting the wafer to be inspected;
a first energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, wherein said first energy-emitting device is positioned at an azimuth angle of substantially 45°
relative to the flat;
a second energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, and in a direction substantially opposing that of said first energy-emitting device;
a third energy-emitting device mounted at a height above the surface of the wafer for emitting energy directed toward and substantially perpendicular to the wafer surface to be inspected; and
an image-capturing device aimed to capture an image of the surface as illuminated by the first, second, and third energy-emitting devices.
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Accused Products
Abstract
A system and method of optically inspecting structures on the surface of an object, such as a semiconductor wafer. A platform is used to support the object under examination, and provided thereat are lights or other energy sources for illumination disposed at a selected angular orientation. Optimum illumination is achieved by orienting two opposing lateral energy sources to direct energy along the surface of the object at a very low angle, and using them in conjunction with a coaxial light source that emits energy, which is directed downward toward the surface. Energy reflected back from the surface is captured as an image by a suitable device such as a CCD camera. The lighting may be controlled by an attached computer, which can also be used to process and store the captured image and analyze it to detect and catagorize defects in the object being inspected.
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Citations
15 Claims
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1. A system for inspecting a surface of a semiconductor wafer having a straight side (flat), said system comprising:
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a support for supporting the wafer to be inspected;
a first energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, wherein said first energy-emitting device is positioned at an azimuth angle of substantially 45°
relative to the flat;
a second energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, and in a direction substantially opposing that of said first energy-emitting device;
a third energy-emitting device mounted at a height above the surface of the wafer for emitting energy directed toward and substantially perpendicular to the wafer surface to be inspected; and
an image-capturing device aimed to capture an image of the surface as illuminated by the first, second, and third energy-emitting devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of inspecting semiconductor wafer having a flat, the method comprising the steps of:
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supporting the wafer on an inspection platform;
emitting energy from a first source along and substantially parallel to the wafer surface to be inspected, wherein the energy emitted from said first source is directed at an angle of substantially 45°
relative to the flat;
emitting energy from a second source along and substantially parallel to the surface to be inspected and in a direction substantially opposing that of the energy emitted from a said first source;
emitting energy from a third source directed toward and substantially perpendicular to the surface to be inspected; and
capturing an image of the illuminated surface. - View Dependent Claims (13, 14, 15)
producing a captured-image surface structure map; and
comparing said structure map it to a stored defect-free surface structure map.
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15. The method of claim 14, further comprising the step of comparing a defect detected in said structure map comparison step to a knowledgebase of stored defect data for classification.
Specification