System and method of optically inspecting surface structures on an object

• US 6,292,260 B1
• Filed: 06/23/1999
• Issued: 09/18/2001
• Est. Priority Date: 07/03/1997
• Status: Expired due to Term

• Current Assignee: Rudolph Technologies Incorporated (Onto Innovation Inc.)
• Original Assignee: ISOA, Inc. (Onto Innovation Inc.)
• Inventors: Harris, Charles, Epp, George C., Guest, Max, Lin, Youling
• Primary Examiner(s): Pham, Hoa Q.
• Application Number:
  US09/338,880
• Time in Patent Office: 818 Days
• Field of Search: 356/237.1, 356/237.2, 356/237.3, 356/237.4, 356/237.5, 356/239.1, 356/394, 356/338, 250/572, 348/125, 348/126, 348/128, 382/141, 382/147, 382/149
• US Class Current: 356/237.4
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/9503 Wafer edge inspection

Abstract

A system and method of optically inspecting structures on the surface of an object, such as a semiconductor wafer. A platform is used to support the object under examination, and provided thereat are lights or other energy sources for illumination disposed at a selected angular orientation. Optimum illumination is achieved by orienting two opposing lateral energy sources to direct energy along the surface of the object at a very low angle, and using them in conjunction with a coaxial light source that emits energy, which is directed downward toward the surface. Energy reflected back from the surface is captured as an image by a suitable device such as a CCD camera. The lighting may be controlled by an attached computer, which can also be used to process and store the captured image and analyze it to detect and catagorize defects in the object being inspected.

Claims

1. A system for inspecting a surface of a semiconductor wafer having a straight side (flat), said system comprising:

a support for supporting the wafer to be inspected;

a first energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, wherein said first energy-emitting device is positioned at an azimuth angle of substantially 45°

relative to the flat;

a second energy-emitting device mounted at a height above the support approximately equal to the height of the surface of the wafer to be inspected and directed to emit energy along and substantially parallel to the surface of the wafer, and in a direction substantially opposing that of said first energy-emitting device;

a third energy-emitting device mounted at a height above the surface of the wafer for emitting energy directed toward and substantially perpendicular to the wafer surface to be inspected; and

an image-capturing device aimed to capture an image of the surface as illuminated by the first, second, and third energy-emitting devices.

2. The system of claim 1, further comprising at least one reflective surface for directing the energy emitted by said third energy-emitting device toward and substantially perpendicular to the surface being inspected.

3. The system of claim 1, wherein said first energy-emitting device is selected from the group consisting of a visible light source, an infrared light source, an ultraviolet light source, an X-ray source, a focused ion beam source, and an electron source.

4. The system of claim 1, wherein said second energy-emitting device is selected from the group consisting of a visible light source, an infrared light source, an ultraviolet light source, an X-ray source, a focused ion beam source, and an electron source.

5. The system of claim 1, wherein said image-capturing device is selected from the group consisting of a line-scan camera and an area-scan camera.

6. The system of claim 1, further comprising means for recording the image captured by said image capturing device.

7. The system of claim 6, wherein said recording means is a computer.

8. The system of claim 7, wherein said computer further comprises software for manipulating image data.

9. The system of claim 8, further comprising a knowledgebase accessible by said computer for receiving and storing a defect-free reference image for comparison.

10. The system of claim 9, wherein said computer performs automatic defect classification for classifying any differences between the captured image associated with the object and the defect-free reference image.

11. The system of claim 8, wherein said computer is capable of generating structure grammar from the captured image.

12. A method of inspecting semiconductor wafer having a flat, the method comprising the steps of:

supporting the wafer on an inspection platform;

emitting energy from a first source along and substantially parallel to the wafer surface to be inspected, wherein the energy emitted from said first source is directed at an angle of substantially 45°

relative to the flat;

emitting energy from a second source along and substantially parallel to the surface to be inspected and in a direction substantially opposing that of the energy emitted from a said first source;

emitting energy from a third source directed toward and substantially perpendicular to the surface to be inspected; and

capturing an image of the illuminated surface.

13. The method of claim 12, further comprising the step of converting the captured image into a pixel-based image.

14. The method of claim 12, further comprising the steps of:

producing a captured-image surface structure map; and

comparing said structure map it to a stored defect-free surface structure map.

15. The method of claim 14, further comprising the step of comparing a defect detected in said structure map comparison step to a knowledgebase of stored defect data for classification.