Servo amplifier unit

• US 6,292,363 B1
• Filed: 04/16/1999
• Issued: 09/18/2001
• Est. Priority Date: 04/16/1998
• Status: Expired due to Fees

• Current Assignee: Fanuc Ltd (Fanuc Corporation)
• Original Assignee: Fanuc Ltd (Fanuc Corporation)
• Inventors: Nakamura, Hideyuki, Takeshita, Makoto, Shinohara, Tatsuo, Suzuki, Naoyuki, Inaba, Kiichi
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/292,920
• Time in Patent Office: 886 Days
• Field of Search: 165/104.33, 174/15.2, 361/688, 361/700, 361/694-695, 361/715, 363/141
• US Class Current: 361/695
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14324 comprising modular units, e.g. DIN rail mounted units

Abstract

A semiconductor module is mounted on a printed circuit board so that a heat radiating surface of the module and surfaces of the printed circuit boards are parallel to inner wall surfaces of a unit case. The total thickness of the semiconductor module constituting an inverter essential to a servo amplifier, and the printed circuit boards on which the semiconductor module is mounted is made substantially equal to a distance between the inner walls of the unit case so that the width of the servo amplifier can be minimized. The other components having sizes smaller than the width of the unit case are selected, and an electrolytic capacitor and the like are divided into a plurality of parts so that the divided parts are separately accommodated. Further, air passages are defined by guide plates closing gaps between the components, so that air is impinge concentratedly on components which need to be cooled during forced air cooling by fans, whereby the cooling efficiency is enhanced, permitting dense arrangement of the components and making it possible to provide a servo amplifier reduced in thickness and in size.

Claims

1. A servo-amplifier, comprising:

a semiconductor module;

a first printed circuit board on which the semiconductor module and components are mounted;

a second printed circuit board on which the semiconductor module is not mounted and on which components are mounted; and

a unit case accommodating said semiconductor module, said first printed circuit board and said second printed circuit board,

wherein said first printed circuit board and said second printed circuit board are placed opposite to each other, a heat radiating surface of said semiconductor module, said first printed circuit board and said second printed circuit board are arranged parallel to inner wall faces of the unit case, respective heights of each of the components mounted on said first printed circuit board and said second printed circuit board are equal to or smaller than a thickness of said semiconductor module, a sum of heights of components positioned in confronting relation with each other on said first printed circuit board and second printed circuit board are equal to or smaller than the thickness of said semiconductor module, and a distance between the inner walls of said unit case is substantially equal to a sum of thicknesses of said semiconductor module and said first printed circuit board.

2. A servo-amplifier according to claim 1, wherein said semiconductor module includes a heat sink attached to the heat radiating surface thereof, respective heights of the components mounted on said first printed circuit board and said second printed circuit board are equal to or smaller than a thickness of said semiconductor module including the attached heat sink, the sum of heights of components positioned in confronting relation with each other on said first printed circuit board and second printed circuit board is substantially equal to or smaller than the thickness of said semiconductor module including the attached heat sink, and a distance between the inner walls of said unit case is substantially equal to sum of thickness of said semiconductor module including the heat sink, and said first printed circuit board.

3. A servo-amplifier according to claim 1, wherein said semiconductor module includes a heat sink having a flat heat pipe attached to the heat radiating surface thereof, respective heights of each of the components mounted on said first printed circuit board and said second printed circuit board are equal to or smaller than a thickness of said semiconductor module including the heat sink having the flat heat pipe, the sum of heights of components positioned in confronting relation with each other on the first printed circuit board and the second printed circuit board is equal to or smaller than the thickness of said semiconductor module including the heat sink having the flat heat pipe, and a distance between the inner walls of said unit case is substantially equal to a sum of respective thicknesses of said semiconductor module including the heat sink having the flat heat pipe and said first printed circuit board.

4. A servo-amplifier according to claim 1, further comprising a cooling fan and a guide plate, wherein said cooling fan and said guide plate are arranged in said unit case to form a pathway for air, which pathway concentrates cooling air generated by said cooling fan on components requiring cooling.