Method for patterning devices

• US 6,294,398 B1
• Filed: 11/23/1999
• Issued: 09/25/2001
• Est. Priority Date: 11/23/1999
• Status: Expired due to Term

• Current Assignee: The Trustees of Princeton University (Princeton University)
• Original Assignee: The Trustees of Princeton University (Princeton University)
• Inventors: Burrows, Paul E., Forrest, Stephen R., Kim, Changsoon
• Primary Examiner(s): Pham, Long
• Application Number:
  US09/447,793
• Time in Patent Office: 672 Days
• Field of Search: 438/22, 438/23, 438/34, 438/35, 438/99, 257/40, 257/88, 257/79
• US Class Current: 438/22
• CPC Class Codes: H10K 50/11 characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/826 Multilayers, e.g. opaque multilayers
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: H10K 59/17 Passive-matrix OLED displays
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
• CPC Class Codes: H10K 71/221 by lift-off techniques
• CPC Class Codes: H10K 71/231 by etching of existing layers
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes

Abstract

The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer of an electrode material over the first layer of organic materials; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Preferably the patterned die is coated with a metal. Optionally the method includes depositing additional layers over the substrate prior to pressing the patterned die.

Claims

1. A method of fabricating an organic device, comprising

(a) depositing a first layer comprising organic materials over a substrate;

(b) depositing over said first layer a second layer comprising an electrode material;

(c) pressing a patterned die having a raised portion onto the second layer; and

(d) removing the patterned die.

2. The method of claim 1, wherein the patterned die comprises silicon.

3. The method of claim 1, wherein the patterned die has a raised portion that is coated with an adhesive material.

4. The method of claim 3, wherein the adhesive material comprises at least one metal.

5. The method of claim 3, wherein the adhesive material comprises glue.

6. The method of claim 1, wherein a third layer is deposited over the substrate prior to depositing a first layer.

7. The method of claim 6, wherein the third layer is patterned prior to depositing a first layer.

8. The method of claim 6, wherein the method is used to fabricate a passive array of organic light emitting devices, each device having a bottom electrode formed from the third layer, an organic light emitting layer formed from the first layer, and a top electrode formed from the second layer.

9. The method of claim 6, wherein the third layer comprises an electrode material.

10. The method of claim 9, wherein the third layer is selected from the group consisting of metals and metal oxides.

11. The method of claim 1, wherein the second layer is selected from the group consisting of metals and metal oxides.