Method for patterning devices
First Claim
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1. A method of fabricating an organic device, comprising(a) depositing a first layer comprising organic materials over a substrate;
- (b) depositing over said first layer a second layer comprising an electrode material;
(c) pressing a patterned die having a raised portion onto the second layer; and
(d) removing the patterned die.
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Abstract
The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer of an electrode material over the first layer of organic materials; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Preferably the patterned die is coated with a metal. Optionally the method includes depositing additional layers over the substrate prior to pressing the patterned die.
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Citations
11 Claims
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1. A method of fabricating an organic device, comprising
(a) depositing a first layer comprising organic materials over a substrate; -
(b) depositing over said first layer a second layer comprising an electrode material;
(c) pressing a patterned die having a raised portion onto the second layer; and
(d) removing the patterned die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification