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Semiconductor interconnect having laser machined contacts

  • US 6,294,837 B1
  • Filed: 08/30/1999
  • Issued: 09/25/2001
  • Est. Priority Date: 12/18/1997
  • Status: Expired due to Term
First Claim
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1. An interconnect for a semiconductor component having an external contact comprising:

  • a substrate having a first side and an opposing second side;

    a contact on the first side configured to make an electrical connection with the external contact, the contact comprising a recess configured to retain the external contact and a conductive layer on the recess configured to electrically engage the external contact; and

    a conductive member in electrical communication with the contact, the conductive member comprising a laser machined opening through the conductive layer and through the substrate to the opposing second side, and a conductive material in the opening in contact with the conductive layer.

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