Chassis grounding ring for a printed wiring board mounting aperture

• US 6,295,210 B1
• Filed: 04/07/2000
• Issued: 09/25/2001
• Est. Priority Date: 04/07/2000
• Status: Expired due to Term

• Current Assignee: RPX Corporation
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Lanzone, Chris Allan, Sandage, Andrea T., Pierson, Richard A.
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US09/544,748
• Time in Patent Office: 536 Days
• Field of Search: 361/752, 361/753, 361/758, 361/796, 361/797, 361/799, 361/801, 361/894, 174/51, 174/138.G, 174/263, 228/165
• US Class Current: 361/799
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 3/0094 Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

A printed wiring board is adapted to be mounted to a chassis using a fastener. The chassis provides an electrical ground for the printed wiring board. The board includes first and second sides and a mounting aperture extending therethrough for receiving the fastener. A plurality of spaced apart solder pads are disposed on one side of the board and adjacent to the mounting aperture. The pads are adapted to provide an electrical connection to the chassis. At lease one aperture is disposed in each of the plurality of pads. The aperture is plated creating an electrical connection between the sides of the board.

Claims

1. A printed wiring board adapted to be mounted to a chassis using a fastener, the chassis providing an electrical ground for the board, the board including;

a printed wiring board having first and second sides, and including a mounting aperture extending therethrough for receiving the fastener; and

a plurality of spaced apart solder pads disposed on one side of said board and adjacent to said mounting aperture, said plurality of spaced apart solder pads being spaced apart by a plurality of gaps to which solder does not adhere, said gaps breaking surface tension of a solder wave to prevent solder from plating over said mounting aperture during soldering of the printed wiring board, and said plurality of solder pads adapted to create an electrical connection to the chassis.

2. The printed wiring board of claim 1 and further including;

a least one aperture disposed in each of said plurality of solder pads; and

said at least one aperture being plated for creating an electrical connection between said sides of said printed wiring board.

3. The printed wiring board of claim 1 and further including:

a pair of apertures disposed in each of said plurality of pads; and

said pair of apertures being plated for providing an electrical connection between said sides of said printed wiring board.

4. A printed wiring board adapted to be mounted to a chassis using a fastener, the chassis providing an electrical ground for the board, the board including;

a printed wiring board having first and second sides, and including a mounting aperture extending therethrough for receiving the fastener; and

two spaced apart solder pads disposed on one side of said board and adjacent to said mounting aperture, said two spaced apart solder pads being spaced apart by two gaps to which solder does not adhere, said gaps disposed about 180°

from each other around said aperture and breaking surface tension of a solder wave to prevent solder from plating over said mounting aperture during soldering of the printed wiring board, and said solder pads adapted to create an electrical connection to the chassis.

5. The printed wiring board of claim 4 and further including;

a least one aperture disposed in each of said solder pads; and

said at least one aperture being plated for creating an electrical connection between said sides of said printed wiring board.

6. The printed wiring board of claim 4 and further including:

a pair of apertures disposed in each of said pads; and

said pair of apertures being plated for creating an electrical connection between said sides of said printed wiring board.

7. A printed wiring board adapted to be mounted to a chassis using a fastener, the chassis providing an electrical ground for the board, the board including;

a printed wiring board having first and second sides, and including a mounting aperture extending therethrough for receiving the fastener; and

four spaced apart solder pads disposed on one side of said board and adjacent to said mounting aperture, said four spaced apart solder pads being spaced apart by four gaps to which solder does not adhere, said gaps disposed about 90°

from each other around said aperture and breaking surface tension of a solder wave to prevent solder from plating over said mounting aperture during soldering of the printed wiring board, and said solder pads adapted to create an electrical connection to the chassis.

8. The printed wiring board of claim 7 and further including;

a least one aperture disposed in each of said solder pads; and

said at least one aperture being plated for creating an electrical connection between said sides of said printed wiring board.

9. The printed wiring board of claim 7 and further including:

a pair of apertures disposed in each of said pads; and

said pair of apertures being plated for creating an electrical connection between said sides of said printed wiring board.

10. A printed wiring board assembly comprising:

a chassis;

a fastener;

a printed wiring board having first and second sides, and including a mounting aperture extending therethrough for receiving said fastener for mounting said printed wiring board to said chassis;

a plurality of spaced apart solder pads disposed on one side of said board and adjacent to said mounting aperture, said plurality of spaced apart solder pads being spaced apart by a plurality of gaps to which solder does not adhere, said gaps breaking surface tension of a solder wave to prevent solder from plating over said mounting aperture during soldering of the printed wiring board, and said plurality of solder pads adapted to create an electrical connection to the chassis;

a least one aperture disposed in each of said plurality of solder pads; and

said at least one aperture being plated for creating an electrical connection between said sides of said printed wiring board.

11. The assembly of claim 10 and further including:

a standoff mounted to said chassis and said printed wiring board, said standoff contacting said plurality of solder pads.

12. The assembly of claim 11 wherein said standoff includes an aperture for receiving said fastener.

13. The assembly of claim 10 wherein said plurality of solder pads comprise four solder pads, each having two apertures.

14. The assembly of claim 10 wherein said plurality of solder pads comprise two solder pads, each having two apertures.