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Method for reducing damage to wafer cutting blades during wafer dicing

  • US 6,295,978 B1
  • Filed: 07/20/2000
  • Issued: 10/02/2001
  • Est. Priority Date: 11/26/1996
  • Status: Expired due to Fees
First Claim
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1. A method of forming a support for a semiconductor wafer at least during dicing of the semiconductor wafer, wherein the semiconductor wafer has a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, comprising:

  • providing a support having a surface for supporting the underside of the semiconductor wafer; and

    forming at least one recess in the surface corresponding to the street index of the semiconductor wafer.

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