Method of fabricating a sensor
First Claim
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1. A method of fabricating a sensor, comprising:
- forming an insulative layer on a first substrate;
forming a patterned conductive layer on the insulative layer;
forming a recess in a first surface of a second substrate;
bonding the first surface of the second substrate to the patterned conductive layer of the first substrate so that the recess defines an enclosed cavity between the first and second substrates;
forming a circuitry for the sensor on a second surface of the second substrate; and
etching a plurality of trenches in the second substrate from the second surface of the cavity, the plurality of trenches defining a vibratory structure formed of the second substrate and conneted to the first substrate by the patterned conductive layer.
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Abstract
A microfabricated gyroscope to measure rotation about an axis parallel to the surface of the substrate. A voltage differential may be applied between pairs of electrode fingers to reduce the quadrature error. A microfabricated gyroscope includes a vibratory structure and interdigited electrodes having a high aspect ratio.
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Citations
16 Claims
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1. A method of fabricating a sensor, comprising:
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forming an insulative layer on a first substrate;
forming a patterned conductive layer on the insulative layer;
forming a recess in a first surface of a second substrate;
bonding the first surface of the second substrate to the patterned conductive layer of the first substrate so that the recess defines an enclosed cavity between the first and second substrates;
forming a circuitry for the sensor on a second surface of the second substrate; and
etching a plurality of trenches in the second substrate from the second surface of the cavity, the plurality of trenches defining a vibratory structure formed of the second substrate and conneted to the first substrate by the patterned conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of fabricating a sensor, comprising:
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providing a first substrate;
providing a second substrate having a first single-crystal silicon layer on a first side, a second single-crystal layer on a second side, and an insulator layer between the first and second layer single-crystal silicon layers;
forming a recess in a first surface on the first side of the second substrate;
bonding the first side of the second substrate to the first substrate so that the recess defines an enclosed cavity between the first and second substrates;
thinning the second substrate on the second side until a second surface of the first single-crystal silicon layer is exposed;
forming circuitry for the sensory on the second surface of the second substrate; and
etching a plurality of trenches in the second substrate from the second surface to the cavity, the plurality of trenches defining a vibratory structure formed of the second substrate and connected to the first substrate.
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Specification