Copper coated polyimide with metallic protective layer

• US 6,296,949 B1
• Filed: 09/16/1999
• Issued: 10/02/2001
• Est. Priority Date: 09/16/1999
• Status: Expired due to Fees

• Current Assignee: Nikko Materials USA, Inc. (Eternal Materials Co., Ltd.)
• Original Assignee: GA-TEK, Inc. (ENEOS Holdings, Inc.)
• Inventors: Poutasse, Charles A., Bergstresser, Tad
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): SAVAGE, JASON L
• Application Number:
  US09/397,404
• Time in Patent Office: 747 Days
• Field of Search: 428/626, 428/607, 174/256
• US Class Current: 428/626
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y10T 428/12438 Composite
• CPC Class Codes: Y10T 428/12569 Synthetic resin

Abstract

A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.

Claims

1. A component for use in manufacturing printed circuits, comprising:

a) a laminate that in a finished printed circuit constitutes a functional element, said laminate comprised of;

a film substrate formed of a first polymeric material;

at least one layer of a tie metal deposited onto a first side of said film substrate, and

at least one layer of copper electrodeposited onto said at least one layer of a tie metal, said layer of copper having an essentially uncontaminated exposed surface facing away from said at least one layer of tie metal; and

b) a planar layer of metal that constitutes a discardable element, said layer of metal having an essentially uncontaminated surface that is inert to copper, said laminate being attached to said layer of metal at its borders, with said essentially uncontaminated, exposed surface of said at least one layer of copper engaging said essentially uncontaminated surface of said layer of metal to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.

2. A component as defined in claim 1, wherein said first polymeric material is polyimide.

3. A component as defined in claim 2, wherein said planar layer of metal is aluminum.

4. A component as defined in claim 2, wherein said tie metal is selected from the group consisting of chromium, nickel, titanium, aluminum, copper, vanadium, silicon, iron and alloys thereof.

5. A component as defined in claim 4, wherein said tie coat has a thickness of between 0 Å

and about 500 Å

.

6. A component as defined in claim 5, wherein said copper layer has a thickness between about 0.1 μ

m and about 70 μ

m.

7. A component as defined in claim 6, wherein said copper layer has a thickness of about 0.2 μ

m.

8. A component as defined in claim 6, wherein said polyimide film has a thickness of between about 12.5 μ

m and about 125 μ

m.

9. A component as defined in claim 1, wherein said laminate is attached to said planar layer of metal by an adhesive applied about the periphery of said laminate.

10. A component as defined in claim 9, wherein said adhesive is a continuous bead applied about the periphery of said laminate that hermetically seals said central zone.

11. A component as defined in claim 1, wherein said first polymeric material is a polyimide, and said component is further comprised of a dimensionally stable adhesive film applied to a second side of said film substrate.

12. A component as defined in claim 11, wherein said adhesive is selected from the group consisting of acrylics, epoxies, nitrile rubbers, phenolics, polyamides, polyarylene ethers, polybenzimidazoles, polyesters, polyimides, polyphenylquinoxalines, polyvinyl acetals, polyurethanes, silicones, vinyl-phenolics, urea-formaldehyde and combinations thereof.

13. A component as defined in claim 12, wherein said adhesive film is an epoxy having a thickness between about 1 mil to about 3 mils.

14. A component for use in manufacturing printed circuits, comprising:

a) a laminate that in a finished printed circuit constitutes a functional element, said laminate comprised of;

a polymer-supported thin layer of copper, said copper being electrodeposited onto said polymer and having a thickness between about 0.1 μ

m and about 70 μ

m and said polymer having a thickness between about 12.5 μ and

about 125 μ

m;

b) a planar layer of metal that constitutes a discardable element, said layer of metal having an essentially uncontaminated surface that is inert to copper, said laminate being attached to said layer of metal at its borders, with said essentially uncontaminated, exposed surface of said at least one layer of copper engaging said essentially uncontaminated surface of said layer of metal to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.

15. A component as defined in claim 14, wherein said polymer is a polyimide.

16. A component as defined in claim 15, wherein said polyimide film supports a layer of copper on both sides thereof.

17. A component as defined in claim 16, wherein the layers of copper on each side of said polyimide film have about the same thickness.

18. A component as defined in claim 15, wherein said laminate is to be dependent on said planar layer of metal by an adhesive applied about the periphery of said laminate.

19. A component as defined in claim 18, wherein said adhesive is a continuous bead applied about the periphery of said laminate that hermetically seals said central zone.