Structure, materials, and applications of ball grid array interconnections

• US 6,297,559 B1
• Filed: 06/30/1998
• Issued: 10/02/2001
• Est. Priority Date: 07/10/1997
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Purushothaman, Sampath, Kang, Sung Kwon, Call, Anson J., Farooq, Shaji, Stalter, Kathleen Ann, DeLaurentis, Stephen Anthony
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Chambliss, Alonzo
• Application Number:
  US09/107,998
• Time in Patent Office: 1,190 Days
• Field of Search: 257/737, 257/738, 257/778, 257/779, 257/780, 257/781, 257/782, 257/783, 257/788, 257/789, 228/180.21, 228/180.22, 298/30, 298/40, 361/760, 361/768, 361/779, 438/108, 438/612, 438/613
• US Class Current: 257/778
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0218 Composite particles, i.e. first metal coated with second metal
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/0425 Solder powder or solder coated metal powder
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.

Claims

1. A structure comprising:

a plurality of electrically conducting spheres disposed in an array on an electronic chip carrier module;

said spheres being electrically and mechanically joined to terminal pads on the module by means of an electrically conducting adhesive;

said spheres being electrically and mechanically joined to terminal pads on a printed circuit board by solder paste; and

wherein the said electrically conducting adhesive comprises;

a thermoplastic or thermosetting polymer resin matrix,

no-clean solder flux,

a plurality of electrically conducting particles with an electrically conductive and fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.

2. A structure according to claim 1, wherein the electrically conducting spheres disposed in said array are made of at least one material selected from the group consisting of Pb, Sn, In, Bi, Sb, Zn, and alloys thereof.

3. A structure according to claim 1, wherein said electrically conducting particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd, and Pt.

4. A structure according to claim 1, wherein said electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof.

5. A structure according to claim 1, wherein said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide-siloxane, phenoxy polymers, styrene allyl alcohol polymers, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

6. A structure according to claim 1, wherein said polymeric material provides adhesive joining of said terminal pads.

7. A structure according to claim 1, wherein said conducting particles are about 1 to about 50 micrometers in diameter.

8. A structure according to claim 1, wherein said fusible coating layer is about 0.1 to about 2 micrometers in thickness.

9. A structure according to claim 1, wherein said structure is an electronic device.

10. A structure according to claim 1, wherein said stricture is a computing device.

11. A structure according to claim 1, wherein said structure is a ball grid array (BGA) electronic package.

12. A structure according to claim 11, wherein said electrically conducting particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd, and Pt;

electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof; and

said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide- siloxane, phenoxy polymers, styrene allyl alcohol polymers, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

13. A structure according to claim 1, wherein the attachment of the said spheres with the said conducting adhesive is achieved by the application of heat and pressure for a duration of time.

14. A structure according to claim 1, wherein the said chip carrier module is selected from the group comprising a metallized ceramic, multilayer cofired ceramic, an organic film optionally provided with a rigid frame, and a section of a printed wiring board.

15. A structure comprising:

a plurality of electrically conducting spheres disposed in an array on an electronic chip carrier module;

said spheres being electrically and mechanically joined to terminal pads on the module by means of an electrically conducting adhesive;

said spheres being electrically and mechanically joined to terminal pads on a printed circuit board by means of another electrically conducting adhesive; and

wherein the said electrically conducting adhesive comprises;

a thermoplastic or thermosetting polymer resin matrix,

no-clean solder flux,

a plurality of electrically conducting particles with an electrically conductive and fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.

16. A structure according to claim 15, wherein the electrically conducting spheres disposed in the array are made of at least one material selected from the group consisting of Pb, Sn, In, Bi, Sb, Zn, and alloys thereof.

17. A structure according to claim 15, wherein said particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd, and Pt.

18. A structure according to claim 15, wherein said electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof.

19. A structure according to claim 15, wherein said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide-siloxane, phenoxy polymers, styrene allyl alcohol, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

20. A structure according to claim 15, wherein said polymeric material provides adhesive joining of said terminal pads.

21. A structure according to claim 15, wherein said conducting particles are about 1 to about 50 micrometers in diameter.

22. A structure according to claim 15, wherein said fusible coating layer is about 0.1 to about 2 micrometers in thickness.

23. A structure according to claim 15, wherein said structure is an electronic device.

24. A structure according to claim 15, wherein said structure is a computing device.

25. A structure according to claim 15, wherein said structure is a ball grid array (BGA) electronic package.

26. A structure according to claim 25 wherein said electrically conducting particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd, and Pt;

electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof; and

said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide- siloxane, phenoxy polymers, styrene allyl alcohol polymers, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

27. A structure according to claim 15, wherein the attachment of the said spheres with the said conducting adhesive is achieved by the application of heat and pressure for a duration of time.

28. A structure according to claim 15, wherein the said chip carrier module is selected from the group comprising a metallized ceramic, multilayer cofired ceramic, an organic film optionally provided with a rigid frame, and a section of a printed wiring board.

29. A structure comprising:

a plurality of electrically conducting spheres disposed in an array on an electronic chip carrier module;

said spheres being electrically and mechanically joined to terminal pads on the module by means of an electrically conducting adhesive;

said spheres being electrically and mechanically joined to terminal pads on a printed circuit board by means of another electrically conducting adhesive;

said electronic chip carrier module being electrically connected to an integrated circuit device by an array of conductive bumps made of an electrically conducting adhesive, and wherein the said electrically conducting adhesive is a mixture comprising;

a thermoplastic or thermosetting polymer resin matrix,

no-clean solder flux,

a plurality of electrically conducting particles with an electrically conductive and fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.

30. A structure according to claim 29, wherein the electrically conducting spheres disposed in the array are made of at least one material selected from the group consisting of Pb, Sn, In, Bi, Sb, Zn, and alloys thereof.

31. A structure according to claim 29, wherein said electrically conducting particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd and Pt.

32. A structure according to claim 29, wherein said electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof.

33. A structure according to claim 29, wherein said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide-siloxane, phenoxy polymers, styrene allyl alcohol polymers, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

34. A structure according to claim 29, wherein said polymeric material provides adhesive joining of said terminal pads.

35. A structure according to claim 29, wherein said conducting particles are about 1 to about 50 micrometers in diameter.

36. A structure according to claim 29, wherein said fusible coating layer is about 0.1 to about 2 micrometers in thickness.

37. A structure according to claim 29, wherein said structure is an electronic device.

38. A structure according to claim 29, wherein said structure is a computing device.

39. A structure according to claim 29, wherein said structure is a ball grid array (BGA) electronic package.

40. A structure according to claim 39, wherein said electrically conducting particles are formed from at least one material selected from the group consisting of Cu, Au, Ag, Al, Pd, and Pt;

electrical coating is selected from the group consisting of Sn, Zn, In, Pb, Bi, and Sb, and combinations thereof; and

said polymeric material is selected from the group consisting of polyimide, siloxane, polyimide- siloxane, phenoxy polymers, styrene allyl alcohol polymers, epoxies and bio-based polymeric resins derived from at least one material selected from the group consisting of lignin, cellulose, wood oil and crop oil.

41. A structure according to claim 29, wherein the attachment of the said spheres with the said conducting adhesive is achieved by the application of heat and pressure for a duration of time.

42. A structure according to claim 29, wherein the said chip carrier module is selected from the group comprising a metallized ceramic, multilayer cofired ceramic, an organic film optionally provided with a rigid frame, and a section of a printed wiring board.