Compact phased array antenna system, and a method of operating same

• US 6,297,775 B1
• Filed: 09/16/1999
• Issued: 10/02/2001
• Est. Priority Date: 09/16/1999
• Status: Expired due to Term

• Current Assignee: OL Security LLC (Intellectual Ventures LLC)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Haws, James L., Short, Jr., Byron Elliott
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/397,486
• Time in Patent Office: 747 Days
• Field of Search: 343/700, 343/853, 165/80.4, 165/168
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 1/288 Satellite antennas
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

An antenna system (10) includes circuitry (13) and an antenna unit (12). The antenna unit includes a multi-layer circuit board (21). The circuitry provides radio frequency signals, control signals and power to the circuit board. The circuit board has an array of antenna elements (23) on one side thereof, and has a plurality of modules (71, 72) soldered to and projecting outwardly from the opposite side thereof. The modules each have electronic circuitry thereon, which is electrically coupled to the circuit board. Each module includes a thermal transfer element (96), the heat generated by the electronic components on that module being thermally transferred by the thermal transfer element to a cooling section (51).

Claims

1. An apparatus, comprising:

an electrical interconnection section which is thin and generally planar;

an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;

a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section; and

a module which is disposed between said interconnection section and said cooling section, which has a circuit board extending approximately perpendicular to said interconnection section, which has electronic components on said circuit board, which includes a first portion operative to electrically couple said electronic components to said interconnection section, and which includes a second portion operative to transfer to said cooling section the heat emitted by said electronic components.

2. An apparatus according to claim 1, wherein said second portion includes a heat transfer member which has portions respectively adjacent said electronic components and said cooling section.

3. An apparatus according to claim 1, wherein said module has a plurality of electrical conductors electrically coupled to said electronic components;

wherein said module includes an arrangement which is cooperable with said circuit board to hermetically seal said electronic components within said module, said arrangement including a frame sealingly coupled to said circuit board and extending around said electronic components thereon, and including a lid sealingly coupled to a side of said frame opposite from said circuit board; and

wherein said first portion of said module includes a wall portion of said frame that has a plurality of conductors electrically coupled to said interconnection section and includes conductive elements which each electrically couple a respective one of said conductors of said wall portion to a respective one of said conductors of said circuit board.

4. An apparatus according to claim 3, wherein said interconnection section includes a further circuit board, and wherein said first portion of said module includes said wall portion having a plurality of connection elements which are each electrically coupled to a respective said conductive element thereon, and which are each soldered to said further circuit board.

5. An apparatus according to claim 1, wherein said interconnection section includes a further circuit board, and wherein said first portion includes said module having at an end thereof adjacent said circuit board a plurality of connection elements which are each soldered to said further circuit board.

6. An apparatus according to claim 1, including a plurality of further modules which are each disposed between said interconnection section and said cooling section, which each have electronic components thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon.

7. An apparatus according to claim 6, wherein said modules are spaced a substantial distance from each other.

8. An apparatus according to claim 1, wherein said electronic components include circuitry which causes said antenna section to function in a multi-beam mode that includes use by said antenna section of at least four separate beams.

9. An apparatus according to claim 8, wherein said electronic components include one of an RF circulator and an RF isolator.

10. An apparatus according to claim 9, wherein said antenna section can both send and receive electromagnetic signals through said antenna elements, and wherein said electronic components include monolithic microwave integrated circuits.

11. An apparatus according to claim 8, wherein said electronic components include a plurality of parts which are each one of an RF circulator and an RF isolator, and which are each associated with a respective one of said beams.

12. An apparatus according to claim 1, including an annular housing which extends between and is coupled to each of said interconnection section and said cooling section, said module being disposed within said housing.

13. An apparatus according to claim 12, wherein said housing is made of a material having a low coefficient of thermal expansion.

14. An apparatus according to claim 1, wherein said interconnection section includes a multi-layer circuit board.

15. An apparatus according to claim 14, wherein said antenna elements of said antenna section are patch antenna elements formed directly on said multi-layer circuit board.

16. An apparatus according to claim 14, wherein said multi-layer circuit board has at least one connector for radio frequency signals, control signals, and power.

17. An apparatus according to claim 1, wherein said cooling section includes a thermally conductive member cooperable with said second portion, and includes a phase change material disposed on a side of said thermally conductive member opposite from said second portion of said module.

18. A method of operating an antenna system which includes a thin and generally planar electrical interconnection section and a plurality of antenna elements disposed on one side of and electrically coupled to said interconnection section, comprising the steps of:

providing on a side of said interconnection section opposite from said antenna elements a module having a circuit board with electronic components thereon;

orienting said circuit board to extend approximately perpendicular to said interconnection section;

transmitting electrical signals between said interconnection section and said electronic components; and

transferring heat emitted by said electronic components to a cooling section which is disposed on a side of said module remote from said interconnection section.

19. A method according to claim 18, further including the steps of:

providing between said interconnection section and said cooling section a plurality of further modules which each have a circuit board with electronic components thereon;

orienting said circuit boards of said further modules to extend approximately perpendicular to said interconnection section;

positioning said modules so that they are spaced a substantial distance from each other;

transmitting electrical signals between said interconnection section and said electronic components on each of said further modules; and

transferring heat emitted by said electronic components on each of said further modules to said cooling section.

20. An apparatus, comprising:

an electrical interconnection section which is thin and generally planar;

an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;

a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section; and

a module which is disposed between said interconnection section and said cooling section, which has electronic components thereon, which includes a first portion operative to electrically couple said electronic components to said interconnection section, and which includes a second portion operative to transfer to said cooling section the heat emitted by said electronic components;

wherein said second portion includes a heat transfer member which has portions respectively adjacent said electronic components and said cooling section;

wherein said module includes a circuit board which extends approximately perpendicular to said interconnection section and has said electronic components thereon; and

wherein said heat transfer member is an L-shaped member having a first leg which is disposed against a portion of said circuit board with said electronic components thereon, and having a second leg which is disposed adjacent a surface portion of said cooling section.

21. An apparatus according to claim 20, wherein said heat transfer member is made of a graphite-based material.

22. An apparatus, comprising:

an electrical interconnection section which is thin and generally planar;

an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;

a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section; and

a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon;

wherein each said module includes a circuit board which extends approximately perpendicular to said interconnection section and has said electronic components thereon; and

wherein each said module includes a heat transfer member which is an L-shaped member having a first leg disposed against a portion of said circuit board with said electronic components thereon, and having a second leg disposed adjacent a surface portion of said cooling section.

23. An apparatus, comprising:

an electrical interconnection section which is thin and generally planar;

an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;

a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section; and

a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon;

wherein each said module includes a circuit board which extends approximately perpendicular to said interconnection section, which has thereon said electronic components of the module, and which has a plurality of electrical conductors electrically coupled to the electronic components;

wherein each said module includes an arrangement which is cooperable with the circuit board thereof to hermetically seal said electronic components thereon within said module, said arrangement including a frame sealingly coupled to the circuit board and extending around said electronic components thereon, and including a lid sealingly coupled to a side of the frame opposite from the circuit board; and

wherein said first portion of each said module includes said frame therefor having a wall portion that has a plurality of conductors electrically coupled to said interconnection section, and includes conductive elements which each electrically couple a respective one of the conductors of the wall portion thereof to a respective one of the conductors of the circuit board thereof.

24. An apparatus according to claim 23, wherein said interconnection section includes a further circuit board, and wherein said first portion of each said module includes said wall portion thereof having a plurality of connection elements which are each electrically coupled to a respective said conductive element thereon, and which are each soldered to said further circuit board.

25. An apparatus, comprising:

an electrical interconnection section which is thin and generally planar;

an antenna section which is disposed on one side of said interconnection section, and which includes a plurality of antenna elements that are each electrically coupled to said interconnection section;

a cooling section which is spaced from said interconnection section on a side thereof opposite from said antenna section;

a plurality of modules which are each disposed between said interconnection section and said cooling section, which are spaced a substantial distance from each other, which each have electronic circuitry thereon, which each include a first portion operative to electrically couple said electronic components thereon to said interconnection section, and which each include a second portion operative to transfer to said cooling section the heat emitted by said electronic components thereon; and

an annular housing which extends between and is coupled to each of said interconnection section and said cooling section, each said module being disposed within said housing.

26. An apparatus according to claim 25, wherein said housing is made of a material having a low coefficient of thermal expansion.