Device for monitoring the travel time of mail shipments

• US 6,298,013 B1
• Filed: 11/15/1993
• Issued: 10/02/2001
• Est. Priority Date: 11/15/1993
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Poeppinghausen, Eberhard Von, Berends, Andreas, Rebel, Burghard, Berlin, Bernhard
• Primary Examiner(s): MISKA, VIT W
• Application Number:
  US08/152,009
• Time in Patent Office: 2,878 Days
• Field of Search: 368/10, 368/85-88, 368/107-113, 361/748-749, 361/750-761, 361/784, 361/789, 235/377, 235/384, 235/487, 340/572.4, 700/572.8, 700/225
• US Class Current: 368/10
• CPC Class Codes: B07C 3/00 Sorting according to destination collating the pages of a book B42C1/00
• CPC Class Codes: G07B 17/00024 Physical or organizational aspects of franking systems
• CPC Class Codes: G07B 17/00508 Printing or attaching on mailpieces printing mechanisms B41J; security printing B41M3/14; marking methods B41M5/00; inks C09D11/00; record carriers with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: G07B 2017/0004 Determining the location of mailpieces outside apparatus
• CPC Class Codes: G07B 2017/00258 Electronic hardware aspects, e.g. type of circuits used
• CPC Class Codes: G07B 2017/00629 Circuit, e.g. transponder
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A device for monitoring the travel time of mail shipments and including a motion sensor, a memory for compiling the measured motion values, an electronic evaluation unit and a current supply. The motion sensor, the memory for the measured values, the electronic evaluation unit and the current supply are arranged on a partially flexible support or circuit board that is configured such that it includes rigid circuit board portions for the arrangement of the motion sensor, the memory for the measured values and the electronic evaluation unit as well as the current supply and these rigid circuit board portions are connected with one another by flexible circuit board portions or components.

Claims

1. A device for dispatch via mail for monitoring the travel time of mail shipments with the device comprising a plurality of electrically interconnected electrical components including a motion sensor, a memory for compiling the measured motion values, an electronic evaluation unit, and a current supply;

and wherein;

the motion sensor, the memory for the measured values, the electronic evaluation unit and the current supply are disposed on a partially flexible circuit board of a configuration such that it includes rigid circuit board portions and flexible portions disposed between and connecting these rigid circuit board portions with one another; and

the motion sensor, the measured value memory, the electronic evaluation unit and the current supply are mounted on the rigid portions of the circuit board.

2. A device as defined in claim 1, wherein said rigid circuit board portions are disposed on a sheet of flexible material in a spaced relationship so that said flexible portions of said circuit board are formed by portions of said sheet between said rigid portions.

3. A device as defined in claim 1, wherein the flexible circuit board portions are covered with a soft substance and the electrical components mounted on the rigid circuit board portions are covered by a casting substance.

4. A device as defined in claim 1, wherein said covered flexible and rigid circuit board portions have substantively the same height to provide a substantively planar surface.

5. A device as defined in claim 1, wherein the rigid circuit board portions are provided with recesses for accommodating circuit components having laterally extending connecting lugs, and said circuit components are mounted such that they project into the recesses with their said connecting lugs soldered to the top surface of the circuit board.

6. A device as defined in claim 1, further comprising a flexible sheet encasing said circuit board and its components.

7. A device according to claim 1, wherein said flexible portions are provided with printed circuits on their surface for interconnection of the circuit components on the respective rigid circuit board portions.

8. A device for dispatch as a letter by mail for monitoring the travel time of mail shipments with the device comprising a plurality of electrically interconnected electrical components including a motion sensor, a memory for compiling the measured motion values, an electronic evaluation unit, and a current supply;

and wherein;

said device has a share of a letter;

the motion sensor, the memory for the measured values, the electronic evaluation unit and the current supply are disposed on a partially flexible circuit board which includes a plurality of laterally spaced rigid circuit board portions and a plurality of flexible portions disposed between and connecting at least adjacent ones of said rigid circuit board portions with one another; and

the motion sensor, the measured value memory, the electronic evaluation unit and the current supply are mounted on the rigid portions of the circuit board.

9. A device as defined in claim 8, wherein the circuit board has a rectangular configuration, said plurality of rigid circuit board portions are all laterally spaced in one of the length and width directions of the rectangular circuit board;

and, the flexible portions extend in the form of strips over the entire other one of the length or width directions of the rectangular circuit board.

10. A device as defined in claim 9, wherein the rigid circuit board portions have a rectangular configuration.

11. A device as defined in claim 8, wherein said plurality of rigid circuit board portions are disposed on one surface of a sheet of flexible material in a laterally spaced relationship, and said flexible portions of said circuit board are formed by portions of said sheet extending between said rigid portions.

12. A device as defined in claim 11, wherein the circuit board has a rectangular configuration, and said plurality of rigid circuit board portions are all laterally spaced in the same one of the length and width directions of the rectangular circuit board.

13. A device as defined in claim 12, wherein the rigid circuit board portions have a rectangular configuration.

14. A device as defined in claim 12, wherein the sheet of flexible material is rectangular, extends to the respective edges of said circuit board, and surrounds said plurality of rigid circuit board portions.

15. A device as defined in claim 8, wherein the flexible circuit board portions are covered with a soft substance and the electrical components mounted on the rigid circuit board portions are covered by a hard casting substance.

16. A device as defined in claim 15, wherein said covered flexible and rigid circuit board portions have substantively the same height to provide a substantively planar surface.

17. A device as defined in claim 8, wherein at least some of the rigid circuit board portions are provided with recesses in a top surface for accommodating circuit components having laterally extending connecting lugs, and said circuit components are mounted such that they project into the recesses and have their said connecting lugs soldered to the top surface of the respective rigid circuit board portion.

18. A device as defined in claim 8, further comprising a flexible sheet encasing said circuit board and the components mounted thereon.

19. A device according to claim 8, wherein said flexible portions are provided with printed circuits on their surface for interconnection of the circuit components on the respective rigid circuit board portions.

20. A device as defined in claim 8 wherein said device has a thickness equal to or less than 5 mm.