Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas

• US 6,298,551 B1
• Filed: 12/13/1999
• Issued: 10/09/2001
• Est. Priority Date: 12/23/1996
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Gorowitz, Bernard, Wojnarowski, Robert John, Whitmore, Barry Scott
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): Smoot, Stephen W.
• Application Number:
  US09/459,586
• Time in Patent Office: 666 Days
• Field of Search: 298/29, 298/30, 438/614, 438/612, 438/613, 427/96
• US Class Current: 29/829
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 2224/02125 Reinforcing structures
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05551 comprising apertures or cavities
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05559 non conformal layer on a patterned surface
• CPC Class Codes: H01L 2224/13005 Structure
• CPC Class Codes: H01L 2224/13011 comprising apertures or cavities, e.g. hollow bump
• CPC Class Codes: H01L 2224/13078 being disposed next to each other, e.g. side-to-side arrangements
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/02 Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 2201/0373 : Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/10257 : Hollow pieces of metal, e.g. used in connection between component and PCB
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 438/94 : Laser ablative material removal
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Claims

1. A method for coupling at least one electrically conductive first contact area and at least one electrically conductive second contact area, the method comprising the steps of:

substantially aligning the at least one electrically conductive first contact area and the at least one electrically conductive second contact area; and

coupling at least one interface structure between the at least one first contact area and the at least one second contact area, the at least one interface structure comprising a crushed wire assembly having a partially open interior to form a compliant joint between the at least one first contact area and the at least one second contact area.

2. The method of claim 1 wherein the at least one first contact area comprises a first array of electrically conductive first contact areas situated on a first surface and the at least one second contact area comprises a second array of electrically conductive second contact areas situated on a second surface;

and wherein

the step of substantially aligning the at least one electrically conductive first contact area and the at least one electrically conductive second contact area comprises substantially aligning selected second contact areas with selected first contact areas; and

the step of coupling the at least one interface structure comprises coupling a plurality of interface structures, each interface structure being coupled to a substantially aligned pair of first and second contact areas.

3. The method of claim 2 wherein the step of coupling includes applying solder bonds between each interface structure and each contact area of the respective substantially aligned pair of first and second contact areas.

4. The method of claim 3 wherein the step of coupling the plurality of interfaces structures includes positioning an interposer structure around the interface structures and between the first and second surfaces.

5. The method of claim 4 wherein the interposer structure comprises a removable material and further including the step of removing the interposer material after coupling the plurality of interface structures.

6. The method of claim 4 wherein the step of positioning the interposer material around the interface structures includes shaping the interface structures to form rivets in holes of the interposer material.

7. The method of claim 6 wherein the step of shaping the interface structures includes shaping loosely fitted rivets.

8. The method of claim 7 wherein the step of shaping loosely fitted rivets includes coating the interface material with a dissolvable material, creating rivets within the interface structure and dissolvable material, and removing the dissolvable material.

9. The method of claim 3 further including, prior to coupling, adding an insulative substance to the interface structures and removing the insulative substance at the edges of the interface structures to be coupled.

10. The method of claim 9 further including, after coupling, removing a remainder of the insulative substance.

11. A method for coupling a first array of electrically conductive first contact areas situated on a first surface and a second array of electrically conductive second contact areas situated on a second surface, the method comprising the steps of:

substantially aligning selected second contact areas with selected first contact areas; and

positioning a plurality of interface structures surrounded by an interposer structure between the first and second surfaces and coupling each interface structure to a substantially aligned pair of first and second contact areas, each interface structure comprising at least one electrical conductor having a partially open interior to form a compliant joint between the respective substantially aligned pair of first and second contact areas; and

removing the interposer structure.

12. A method for coupling a first array of electrically conductive first contact areas situated on a first surface and a second array of electrically conductive second contact areas situated on a second surface, the method comprising the steps of:

substantially aligning selected second contact areas with selected first contact areas;

providing an interposer structure having holes in which a plurality of interface structures are situated and shaped to form rivets therein, each interface structure comprising at least one electrical conductor having a partially open interior to form a compliant joint; and

positioning the interposer structure and the interface structures between the first and second surfaces and coupling each interface structure to a substantially aligned pair of first and second contact areas.

13. The method of claim 12 wherein providing the interposer structure includes shaping the interface structures to form loosely fitted rivets.

14. The method of claim 13 wherein the step of shaping loosely fitted rivets includes coating the interface material with a dissolvable material, creating rivets within the interface structure and dissolvable material, and removing the dissolvable material.