Enhanced plasma mode and system for plasma immersion ion implantation
First Claim
1. A plasma treatment method comprising:
- forming an rf plasma discharge in a vacuum chamber, said plasma discharge including an inductive coupling structure, said inductive coupling structure comprising a first cusp region at a first end of said structure and a second cusp region at a second end of said structure;
wherein said first cusp region is provided by a first electro-magnetic source and said second cusp region is provided by a second electro-magnetic source; and
wherein said first electro-magnetic source and said second electro-magnetic source confining a substantial portion of said rf plasma discharge to a region away from a wall of said vacuum chamber.
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Abstract
A novel plasma treatment method (800, 814). The method includes forming an rf plasma discharge in a vacuum chamber. The plasma discharge includes an inductive coupling structure, which has a first cusp region at a first end of the structure and a second cusp region at a second end of the structure. In some embodiments, a third cusp region, which is between the first and second cusp regions, can also be included. The first cusp region is provided by a first electro-magnetic source and the second cusp region is provided by a second-electro magnetic source. The first electro-magnetic source and the second electro-magnetic source confines a substantial portion of the rf plasma discharge to a region away from a wall of the vacuum chamber. Accordingly, a plasma discharge is substantially a single ionic species (e.g., H1+) can be formed.
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Citations
16 Claims
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1. A plasma treatment method comprising:
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forming an rf plasma discharge in a vacuum chamber, said plasma discharge including an inductive coupling structure, said inductive coupling structure comprising a first cusp region at a first end of said structure and a second cusp region at a second end of said structure;
wherein said first cusp region is provided by a first electro-magnetic source and said second cusp region is provided by a second electro-magnetic source; and
wherein said first electro-magnetic source and said second electro-magnetic source confining a substantial portion of said rf plasma discharge to a region away from a wall of said vacuum chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification