Thermosetting resin composition

• US 6,300,425 B1
• Filed: 04/06/1999
• Issued: 10/09/2001
• Est. Priority Date: 05/11/1998
• Status: Expired due to Fees

• Current Assignee: Nisshinbo Industries, Inc. (Kawasaki Heavy Industries Limited)
• Original Assignee: Nisshinbo Industries, Inc. (Kawasaki Heavy Industries Limited)
• Inventors: Amano, Satoshi, Tomita, Hideshi
• Primary Examiner(s): SERGENT, RABON A
• Application Number:
  US09/286,801
• Time in Patent Office: 917 Days
• Field of Search: 525/452, 525/528, 525/540
• US Class Current: 525/452
• CPC Class Codes: C08G 18/025 the polymeric products containing carbodiimide groups
• CPC Class Codes: C08G 59/4042 Imines; Imides
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
• CPC Class Codes: C09D 163/00 Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Abstract

A modified carbodiimide resin obtainable by reacting a carbodiimide resin comprising a repeating unit represented by the general formula: —(NCN—R¹)— wherein R¹ represents a divalent organic group, with an aromatic diamine represented by the general formula: H₂N—R²—NH₂ wherein R² represents a divalent organic group having a benzene ring, and a thermosetting resin composition comprising the modified carbodiimide resin and an epoxy resin.

Claims

1. A thermosetting resin composition comprising:

a modified carbodiimide resin obtained by reacting a carbodiimide resin comprising a repeating unit represented by the general formula;

—

(NCN—

R¹)—

, wherein R¹ represents a divalent organic group, with an aromatic diamine represented by the general formula;

H₂N—

R²—

NH₂ wherein R² represents a divalent organic group having a benzene ring, and

an epoxy resin.

2. The thermosetting resin composition according to claim 1, wherein R¹ is a group derived from an aromatic diisocyanate.

3. The thermosetting resin composition according to claim 1, wherein the aromatic diamine is diaminodiphenyl sulfone or diaminodiphenylmethane.

4. The thermosetting resin composition according to claim 2, wherein the aromatic diamine is diaminodiphenyl sulfone or diaminodiphenylmethane.

5. The thermosetting resin composition according to claim 1, wherein the epoxy resin is a bisphenol epoxy resin or a novolak epoxy resin.

6. The thermosetting resin composition according to claim 2, wherein the epoxy resin is a bisphenol epoxy resin or a novolak epoxy resin.

7. The thermosetting resin composition according to claim 3, wherein the epoxy resin is a bisphenol epoxy resin or a novolak epoxy resin.

8. The thermosetting resin composition according to claim 4, wherein the epoxy resin is a bisphenol epoxy resin or a novolak epoxy resin.