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Contact-less probe of semiconductor wafers

  • US 6,300,785 B1
  • Filed: 10/20/1998
  • Issued: 10/09/2001
  • Est. Priority Date: 10/20/1998
  • Status: Expired due to Fees
First Claim
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1. A device having a built-in contact-less probe for allowing contact-less testing of said device, said probe comprising:

  • a test circuit including a frequency generator for generating a detectable radio frequency energy when powered, wherein said frequency generator changes a frequency of said radio frequency energy depending upon the presence of defects within said device; and

    a power generator, coupled to said frequency generator, for generating power when exposed to light.

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