Component for optical data transmission

• US 6,301,035 B1
• Filed: 06/25/1998
• Issued: 10/09/2001
• Est. Priority Date: 06/28/1997
• Status: Expired due to Fees

• Current Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Original Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Inventors: Schairer, Werner
• Primary Examiner(s): NEGASH, KINFE MICHAEL
• Application Number:
  US09/104,767
• Time in Patent Office: 1,202 Days
• Field of Search: 359/152, 359/153, 359/159, 359/193, 359/163
• US Class Current: 398/128
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H04B 10/11 : Arrangements specific to free-space transmission, i.e. transmission through air or vacuum

Abstract

An infrared transceiver for a directed bi-directional optical data transmission through the air has a single-part or multi-part housing in which a stack of components is mounted as follows: an emitter chip for transmitting IR beams, a detector chip for receiving IR beams, and an optical system with a lens and a reflector having an optical axis for focusing the transmitted and received beams. The reflector is arranged concentrically to the optical axis and relative to the components so that transmission power and reception sensitivity of the IR transceiver are increased.

Claims

1. An infrared transceiver for a bi-directional optical data transmission of directed IR beams through the atmosphere, said infrared transceiver comprising:

a housing (3) including an infrared input/output (IO) defining a common plane (CP) facing the atmosphere through which said IR beams pass, said infrared transceiver further comprising a stack (S) mounted in said housing and defining an optical axis (OA) extending perpendicularly to said common plane (CP), said stack (S) comprising in the following order a carrier (5) remote from said common plane (CP), an integrated circuit (6) mounted on said carrier, an IR detector chip (8) secured to said integrated circuit (6) coaxially to said optical axis and facing said common plane, an emitter chip (10) bonded centrally to said detector chip coaxially to said optical axis and facing said common plane (CP) so that said emitter chip (10) is closest to said common plane (CP), an optical lens (2A, 2A′

) positioned in said housing (3) coaxially to said optical axis (OA) between said stack (S) and said common plane, and a reflector (13) surrounding said stack (S) and said lens (2) in said housing coaxially to said optical axis for reflecting incoming and outgoing IR beams (14, 15).

2. The infrared transceiver of claim 1, wherein said integrated circuit (6) has a first surface area facing said common plane, wherein said detector (8) has a second surface area facing said common plane, wherein said emitter (10) has a third surface area facing said common plane, and wherein said second surface area is smaller than said first surface area and said third surface area is smaller than said second surface area.

3. The infrared transceiver of claim 1, wherein said housing comprises a cavity in the form of a paraboloid, and wherein said paraboloid cavity comprises an IR reflecting surface forming said reflector (13).

4. The infrared transceiver of claim 1, wherein said reflector (13) comprises a focal point and wherein at least said emitter chip (10) and said detector chip (8) are arranged in said focal point.

5. The infrared transceiver of claim 1, wherein said reflector (13) is made of a thermosetting or thermoplastic material transparent to IR radiation and forming a paraboloid having an IR radiation reflecting surface.

6. The infrared transceiver of claim 5, wherein said IR radiation reflecting surface is a vapor deposition metal mirror surface.

7. The infrared transceiver of claim 1, wherein said lens comprises a first spherical lens segment (16), and a second spherical lens segment (2A) having a radius smaller than a radius of said first spherical lens segment (16), wherein said first and second lens segments are positioned coaxially in said reflector (13) with said second lens segment (2A) having said smaller radius positioned closer to said common plane (CP) and said first lens segment (16) positioned closer to said stack (S) so that incoming reflected IR beams (14) and outgoing reflected IR beams (15) must pass at least through said first lens segment (16), and wherein non-reflected incoming and outgoing IR beams must pass through said first and second lens segments. (FIG. 1)

8. The infrared transceiver of claim 7, wherein said housing comprises a first housing section (3) and a second housing section (17), said first and second lens sections (16, 2A) forming an integral part of said first housing section (3), and wherein said reflector (13) is an integral part of said second housing section (17).

9. The infrared transceiver of claim 1, wherein said housing comprises a first housing section (3) and a second housing section (18), said reflector comprising a first reflector segment (13A) in said first housing section and a second reflector segment (13B) in said second housing section (18), and wherein said lens comprises a central lens section (2A′

) and a lens mounting ring (2B) securing said central lens section (2A′

) in said second housing section (18), wherein said central lens section and said lens mounting ring are made of IR transparent material, so that incoming IR beams (14) passing through said lens mounting ring (2B) are also reflected onto said detector chip (8) and outgoing IR beams (15) are also reflected outwardly through said lens mounting ring (2B). (FIG.

     2)

10. The infrared transceiver of claim 9, wherein said central lens section (2A′

), said lens mounting ring (2B) and said second housing section (18) form an integral component connectable to said first housing section (3).