Isothermal heat sink with cross-flow openings between channels

• US 6,301,109 B1
• Filed: 02/11/2000
• Issued: 10/09/2001
• Est. Priority Date: 02/11/2000
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Simons, Robert E., Ellsworth, Michael J. Jr., Chu, Richard C.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/501,640
• Time in Patent Office: 606 Days
• Field of Search: 361/683, 361/685, 361/690, 361/699-709, 361/711, 361/727, 361/688, 361/700-714, 165/80.4, 165/171, 165/185, 165/41, 165/108, 165/47, 165/80.3, 165/104.21, 165/104.33, 165/104.25, 165/166, 165/168, 165/170, 165/104.34, 165/165, 165/169, 257/714-716, 257/706-727, 298/900.3, 298/900.38, 298/900.4, 174/15.1, 622/592
• US Class Current: 361/690
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 2250/04 Communication passages between channels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: F28F 9/026 with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one cross-flow opening is provided between at least some adjacent channels of the plurality of channels so that coolant flow can flow within the member between the first group of channels and the second group of channels.

Claims

1. Apparatus for cooling an electronic device, comprising:

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member includes a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member;

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels; and

wherein said first group of channels and said second group of channels have ends and said at least one cross-flow opening between the at least some adjacent channels is distal said ends.

3. The apparatus of claim 1, wherein said at least one cross-flow opening comprises a plurality of cross-flow openings disposed between each pair of adjacent channels of said plurality of channels within said heat sink member.

11. The apparatus as in claim 1, wherein the coolant flow establishes a boundary layer in at least one of the first group of channels and the second group of channels;

and the at least one cross-flow opening is positioned so that fluid flow through said at least one cross-flow opening disturbs the boundary layer by creating localized turbulent flow which increases the cooling capacity of the heat sink member compared to a member without said at least one cross-flow opening.

2. Apparatus for cooling an electronic device, comprising:

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member includes a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member; and

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels;

wherein said at least one cross-flow opening between at least some adjacent channels comprises a plurality of cross-flow openings between said at least some adjacent channels, wherein cross-flow openings of said plurality of cross-flow openings are disposed closer together near a center portion of said heat sink member.

4. Apparatus for cooling an electronic device, comprising:

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member includes a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member; and

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels;

wherein said at least one cross-flow opening comprises a plurality of cross-flow openings disposed between each pair of adjacent channels of said plurality of channels within said heat sink member; and

wherein cross-flow openings of said plurality of cross-flow openings between each pair of adjacent channels are disposed closer together near a center portion of said heat sink member.

5. The apparatus of claim 4, wherein fluid flow cross-sections of at least some of said plurality of cross-flow openings vary from an outer portion of said heat sink member to said center portion of said heat sink member.

6. A fluid-cooled electronic apparatus, comprising:

an electronic device;

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member has a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member;

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels; and

wherein said first group of channels and said second group of channels have ends and said at least one cross-flow opening is distal said ends.

8. The fluid-cooled electronic apparatus of claim 6, wherein said at least one cross-flow opening comprises a plurality of cross-flow openings disposed between each pair of adjacent channels of said plurality of channels within said heat sink member.

12. The apparatus as in claim 6, wherein the coolant flow establishes a boundary layer in at least one of the first group of channels and the second group of channels;

and the at least one cross-flow opening is positioned so that fluid flow through said at least one cross-flow opening disturbs the boundary layer by creating localized turbulent flow which increases the cooling capacity of the heat sink member compared to a member without said at least one cross-flow opening.

7. A fluid-cooled electronic apparatus, comprising:

an electronic device;

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member has a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member; and

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels;

wherein said at least one cross-flow opening between at least some adjacent channels comprises a plurality of cross-flow openings between said at least some adjacent channels, wherein cross-flow openings of said plurality of cross-flow openings are disposed closer together near a center portion of said heat sink member.

9. A fluid-cooled electronic apparatus, comprising:

an electronic device;

a heat sink member with a surface for making thermal contact with said electronic device;

wherein said heat sink member has a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member; and

at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels;

wherein said at least one cross-flow opening comprises a plurality of cross-flow openings disposed between each pair of adjacent channels of said plurality of channels within said heat sink member; and

wherein cross-flow openings of said plurality of cross-flow openings between each pair of adjacent channels are disposed closer together near a center portion of said heat sink member.

10. The fluid-cooled electronic apparatus of claim 9, wherein fluid flow cross-sections of said plurality of cross-flow openings vary from an outer portion of said heat sink member to said center portion of said heat sink member.

13. A method for cooling an electronic device, said electronic device having a heat sink member with a surface for making thermal contact with said electronic device, said heat sink member including a plurality of channels for carrying coolant fluid, said plurality of channels comprising a first group of channels and a second group of channels, wherein said first group of channels and said second group of channels are positioned generally alternately across said member so that coolant flow alternates direction across said member;

and at least one cross-flow opening between at least some adjacent channels of said plurality of channels such that coolant fluid can flow within said member between said first group of channels and said second group of channels; and

wherein the first group of channels and the second group of channels have ends and said at least one cross-flow opening between the at least some adjacent channels is distal said ends, said method comprising;

providing coolant to said first group of channels and said second group of channels wherein a fluid flow having a boundary layer is established in at least one group of channels; and

wherein the at least one cross-flow opening is positioned so that fluid flows through said at least one cross-flow opening and disturbs the boundary layer of the fluid flow in at least one group of channels; and

wherein the disturbing of the boundary layer produces localized turbulent flow which increases the cooling capacity of the heat sink member compared to a member without said fluid flow through said at least one cross-flow opening.

14. The method as recited in claim 13, further comprising providing coolant at a first end of said first group of channels at a first pressure and providing coolant at a first end of said second group of channels, opposite the first end of the first group of channels, at a second pressure, wherein said first and second pressures decrease along the length of said first group of channels and said second group of channels and a pressure difference is created across said at least one cross-flow opening.

15. The method as recited in claim 14, wherein said first pressure and said second pressure are approximately equal.

16. The method of claim 13, wherein said at least one cross-flow opening comprises a plurality of cross-flow openings.