Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
First Claim
Patent Images
1. A plasma etch-resistant photoresist composition comprised of:
- (a) an organotitanium polymer or organotitanium copolymer produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate), with addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic acid esters or mixtures thereof; and
(b) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin casting.
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Abstract
A composition is derived from an addition polymerizable organotitanium polymer which upon exposure to an oxygen plasma or baking in air, is converted to titanium dioxide (titania) or is converted to a mixed, titanium-containing metal oxide. The metal oxide formed in situ imparts etch-resistant action to a patterned photoresist layer. The composition may also be directly deposited and patterned into permanent metal oxide device features by a photolithographic process.
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Citations
48 Claims
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1. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or organotitanium copolymer produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate), with addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic acid esters or mixtures thereof; and
(b) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin casting. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
wherein Rc equals —
CH2—
CH2—
O—
CO—
C(CH3)═
CH2, Bu equals —
CH2—
CH2—
CH2—
CH3, x+y=2, x equals 0.1 to 2.0, and n>
2.
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9. The plasma etch-resistant photoresist composition of claim 1 wherein the organotitanium polymer is the reaction product of a poly(alkyltitanate) and a titanium chelant which has been functionalized to enable addition polymerization.
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10. The plasma etch-resistant photoresist composition of claim 1 wherein the organotitanium polymer is produced by reacting poly(n-butyltitanate) and an alpha-hydroxy carboxylic acid salt, said polymer or copolymer having the formula:
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where B+ equals —
(H3C)2NH+—
R—
COCA═
CH2, R equals —
CH2—
CH2—
CH2—
NH—
or —
CH2—
CH2—
O—
, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 to 2.0, A equals —
H or —
CH3, and n>
2.
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11. The plasma etch-resistant photoresist composition of claim 1 wherein the organotitanium polymer is the reaction product of a titanate orthoester having at least one ethylenically unsaturated double bond and a limited amount of water to form a soluble polymeric condensation product.
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12. The plasma etch-resistant photoresist composition of claim 1 wherein the organotitanium polymer is produced by reacting copolymers of alkytitanates and alkylsilicates and other alkylmetallates having metals selected from the group consisting of aluminum, zirconium, cerium, niobium, and tantalum.
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13. The plasma etch-resistant photoresist composition of claim 1 wherein the photoresist composition is further comprised of materials to enhance color, with the material being selected from the group consisting of solvent-soluble dyes and pigments.
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14. The plasma etch-resistant photoresist composition of claim 1 wherein the solvent is selected from the group consisting of:
- alcohols, esters, glymes, ethers, glycol ethers, ketones, and combinations thereof.
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15. The plasma etch-resistant photoresist composition of claim 1 wherein exposure to a high energy source will crosslink the organotitanium polymer or copolymer by inducing addition polymerization.
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16. The plasma etch-resistant photoresist composition of claim 15 wherein the high energy source is selected from the group consisting of an electron beam, an x-ray source, and combinations thereof.
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17. The plasma etch-resistant composition of claim 1 wherein the composition further comprises a free radical-generating photopolymerization initiator or initiator system.
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18. The plasma etch-resistant photoresist composition of claim 17 wherein the free radical initiator or initiator system operates effective 200-500 nm exposure wavelenghts.
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19. An organotitanium polymer capable of addition polymerization, wherein the organotitanium polymer is selected from the group consisting of:
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(a) where Rc equals —
CH2CH2OCOC(CH3)═
CH2, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 and 2.0, and n>
2; and
where B+ equals —
(H3C)2NH+—
R—
COCA═
CH2, R equals —
CH2—
CH2—
CH2—
NH—
or —
CH2—
CH2—
O—
, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 and 2.0, A equals —
H or —
CH3, and n>
2.
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20. A method for forming an organotitanium polymer capable of addition polymerization, wherein the method is comprised of:
- reacting a titanium polymer or copolymer selected from the group consisting of poly(alkyltitanates) and poly(alkyltitanates-co-alkylmetallates) with a compound selected from the group consisting of addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, and alpha-hydroxy carboxylic acid esters, wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate).
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21. An organotitanium polymer capable of addition polymerization, wherein the organotitanium polymer is the reaction product of:
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(a) a titanium polymer or copolymer selected from the group consisting of poly(alkyltitanates) and poly(alkyltitanates-co-alkylmetallates), wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate; and
(b) a compound selected from the group consisting of addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, and alpha-hydroxy carboxylic acid esters.
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22. A dried photoresist composition on a substrate, wherein the photoresist composition is comprised of:
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(a) an addition polymerizable organotitanium polymer added in an amount equal to between about 15% by weight and about 90% by weight of the photoresist composition, said polymer being produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate), with addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic acid, esters or mixtures thereof; and
(b) a photopolymerization initiator that operates at 200-500 nm added in an amount equal to between about 1% and about 20% by weight of the photoresist composition. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30)
where Rc equals —
CH2CH2OCOC(CH3)═
CH2, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 and 2.0, and n>
2; and
,(b) where B+ equals —
(H3C)2NH+CH2CH2OCOCA═
CH2, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 and 2.0, A equals —
H or —
CH3, and n>
2.
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26. The photoresist composition of claim 22 wherein the photopolymerization initiator is selected from the group consisting of:
- trihalomethyl-substituted triazines, trihalomethyl-substituted oxadiazoles, imidazoles, hexaaryl biimidazoles, benzoin alkyl ethers, anthraquinones, benzanthrones, benzophenones, acetophenones, thioxanthones, benzoic acid esters, acridines, phenazines, titanium compounds, and mixtures thereof.
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27. The photoresist composition of claim 22 wherein the photoresist composition includes a co-monomer added in an amount equal to between about 0 and about 80% by weight of the photoresist composition, with the co-monomer selected from the group consisting of:
- mono- and polyfunctional (meth)acrylate esters, ethylene glycol dimethacrylate, pentaerythritol triacrylate, tetraacrylate, dipentaerythritol pentaacrylate and hexaacrylate;
polyester (meth)acrylates obtained by reacting (meth)acrylate acid with polyester prepolymers, urethane (meth)acrylates, epoxy (meth)acrylates prepared by reacting (meth)acrylic acid with epoxy resins such as bisphenol-A epoxy resins, bisphenol-F epoxy resins, and novolak epoxy resins, and tris(2-acryloyloxyethyl) isocyanurate.
- mono- and polyfunctional (meth)acrylate esters, ethylene glycol dimethacrylate, pentaerythritol triacrylate, tetraacrylate, dipentaerythritol pentaacrylate and hexaacrylate;
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28. The photoresist composition of claim 27 wherein the co-monomer is added in an amount equal to between about 0 and about 50% by weight of the photoresist composition.
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29. The photoresist composition of claim 22 wherein the photoresist composition includes a non-photopolymerizable metallic compound added in an amount equal to between about 0 and about 60% by weight of the photoresist composition, with the metallic compound selected from the group consisting of:
- metal carboxylates, metal alkoxides, metal hydroxides, metal organo chelates, and metal salts.
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30. The photoresist composition of claim 29 wherein the non-photopolymerizable metallic compound is added in an amount equal to between about 0 and about 40% by weight of the photoresist composition.
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31. A method for preparing a photoresist composition, wherein the method is comprised of:
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(a) stirring in a solvent solution an addition polymerizable organotitanium polymer and a photopolymerization initiator, said polymer being produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate), with addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic acid, esters or mixtures thereof; and
(b) diluting the composition of step (a) with additional solvent to achieve a total solids level of about 30% by weight, thereby forming the photoresist composition. - View Dependent Claims (32, 33, 34)
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35. A microelectronic device structure comprising a plasma etch resistant, titanium-containing photoresist layer coated on a substrate wherein the photoresist layer has a film thickness ranging between about 0.05 microns and about 1.00 microns, with the microelectronic device structure comprised of:
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(a) the substrate selected from the group consisting of ceramic, metal, polymer, and semiconductor substrates; and
(b) the photoresist layer, with the photoresist layer comprised of an addition polymerizable organotitanium polymer added in an amount equal to between about 15% by weight and about 90% by weight of the photoresist composition and a photopolymerization initiator that operates at 200-500 nm added in an amount equal to between about 1% and about 20% by weight of the photoresist composition, said polymer being produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof wherein the alkyl groups of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate) are bonded to respective oxygen atoms which are bonded to the titanium atom of the poly(alkyltitanate) or poly(alkyltitanate-co-alkylmetallate), with addition polymerizable beta-diketones, beta-ketoesters, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic acid esters or mixtures thereof.
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36. A method for forming a microelectronic device structure having a titanium containing metal oxide layer, comprised of:
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(a) selecting a substrate material selected from the group consisting of ceramic, metal, polymer, and semiconductor substrates;
(b) applying a photoresist composition comprised of a photopolymerizable organotitanium polymer to the substrate by spin coating the photoresist composition onto the substrate at a speed ranging between 500 and 5000 rpm for a time equal to between about 30 seconds and 90 seconds, so that the photoresist is present on the substrate at a thickness equal to between about 0.05 microns and about 1.00 microns, thereby forming a photoresist coated substrate;
(c) exposing the photoresist coated substrate to ultraviolet radiation passing through a mask, wherein the ultraviolet radiation is equal to between about 10 mJ/cm2 and about 1000 mJ/cm2 to form an exposed photoresist coated substrate;
(d) developing the exposed photoresist coated substrate in a solution selected from the group consisting of an aqueous alkali solution and an aqueous chelant solution to form a patterned photoresist; and
,(e) converting the patterned photoresist to an etch resistant metal oxide layer on the substrate by heating, thereby forming the microelectronic device structure. - View Dependent Claims (37)
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38. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or copolymer produced by reacting;
a poly(alkyltitanate) or a poly(alkyltitanate-co-alkylmetallate) or mixtures thereof, with addition polymerizable alcohols, carboxylic acids, beta-diketones, beta-ketoesters, or alpha-hydroxy carboxylic acids, alpha-hydroxy carboxylic acid salts, alpha-hydroxy carboxylic esters, or mixtures thereof, said polymer comprising an addition polymerizable co-monomer having at least one ethylenically unsaturated double bond;
(b) a free radical-generating photopolymerization initiator or initiator system; and
,(c) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin casting. - View Dependent Claims (39, 40, 41, 42)
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43. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or copolymer produced by reacting alkyltitanates and alkylsilicates and other alkylmetallates having metal selected from the group consisting of aluminum, zirconium, cerium, niobium, and tantalium;
(b) a free radical-generating photopolymerizable initiator or initiator system; and
(c) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin-casting.
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44. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or copolymer produced by reacting poly(n-butyltitanate) and 2-acetoacetoxyethyl (meth)acrylate, said polymer or copolymer having the formula;
wherein Rc equals —
CH2—
CH2—
O—
CO—
C (CH3)═
CH2, Bu equals —
CH2—
CH2—
CH2—
CH3, x+y=2, x equals 0.1 to 2.0, and n>
2.
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45. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or copolymer produced by reacting a poly(alkyltitanate) and titanium chelant which has been functionalized to enable addition polymerization;
(b) a free radical-generating photopolymerizable initiator or initiator system; and
(c) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin-casting.
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46. A plasma etch-resistant photoresist composition comprised of:
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(a) an organotitanium polymer or copolymer produced reacting poly(n-butyltitanate) and an alpha-hydroxycarboxylic acid salt, said polymer or copolymer having the formula;
where B+ equals (H3C)2NH+—
R—
COCA═
CH2, R equals —
CH2—
CH2—
CH2—
NH—
or —
CH2—
CH2—
O—
, Bu equals —
CH2CH2CH2CH3, x+y=2, x is between 0.1 to 2.0, A equals —
H or —
CH3, and n>
2;
(b) a free radical-generating photopolymerizable initiator or initiator system; and
(c) a solvent vehicle suitable for obtaining high quality thin films on device substrates by spin-casting.
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47. A method for preparing a photoresist composition, wherein the method is comprised of:
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(a) stirring in a solvent solution an addition polymerizable organotitanium polymer, a photopolymerization initiator, and a co-monomer; and
(b) diluting the composition of step (a) with additional solvent to achieve a total solids level of about 30% by weight, thereby forming the photoresist composition.
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48. A method for preparing a photoresist composition, wherein the method is comprised of:
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(a) stirring in a solvent solution an addition polymerizable organotitanium polymer, a photopolymerization initiator, and a non-addition polymerizable metallic composition; and
(b) diluting the composition of step (a) with additional solvent to achieve a total solids level of about 30% by weight, thereby forming the photoresist composition.
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Specification