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Method and apparatus for electroless plating a contact pad

  • US 6,303,500 B1
  • Filed: 02/24/1999
  • Issued: 10/16/2001
  • Est. Priority Date: 02/24/1999
  • Status: Expired due to Fees
First Claim
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1. A method for plating a conductive layer in an integrated circuit, comprising:

  • immersing the integrated circuit in a cleaning fluid comprising a reducing agent that etches oxide from the conductive layer; and

    transferring the integrated circuit from the cleaning fluid to a separate plating fluid without exposing the integrated circuit to air, wherein transferring comprises passing the integrated circuit from the cleaning fluid directly to a second fluid that selectively forms a protective layer on an insulating material surrounding the conductive layer, and the plating fluid selectively forms a conducting material on the conductive layer.

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