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Printed circuit boards

  • US 6,303,880 B1
  • Filed: 09/11/1998
  • Issued: 10/16/2001
  • Est. Priority Date: 06/06/1995
  • Status: Expired due to Term
First Claim
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1. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit including an opening portion exposing the inner layer of the another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit so as to match a position of the viahole with a position of the solder bump, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.

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