Printed circuit boards
First Claim
1. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit including an opening portion exposing the inner layer of the another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit so as to match a position of the viahole with a position of the solder bump, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.
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Accused Products
Abstract
Printed circuit board suitable for the high densification of mounting parts using a solder bump and having improved connection and mounting reliability, wherein the printed circuit board includes a mounting pad provided with a solder bump by covering the mounting surface with a solder resist, and a position of forming the solder bump is arranged so as to match with a position of the viahole, or a size of the opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not be overlap the solder resist with the viahole.
37 Citations
10 Claims
- 1. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit including an opening portion exposing the inner layer of the another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit so as to match a position of the viahole with a position of the solder bump, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.
- 6. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit, a solder bump filling said viahole, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.
Specification