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Method of and apparatus for sealing an hermetic lid to a semiconductor die

  • US 6,303,986 B1
  • Filed: 07/29/1998
  • Issued: 10/16/2001
  • Est. Priority Date: 07/29/1998
  • Status: Expired due to Term
First Claim
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1. A microelectronic machine (MEM) having an hermetic seal comprising:

  • a. a substrate on which is formed an active MEM device;

    b. a lid sealing region surrounding the active MEM device and having a passivation layer formed thereon;

    c. a first layer of solderable material formed over the lid sealing region;

    d. a layer of solder formed over the first layer of solderable material;

    e. a second layer of solderable material formed over the solder; and

    f. a lid formed over the second layer of solderable material forming an hermetic seal thereby, wherein the passivation layer is configured to position the lid a finite distance from the active MEM device.

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